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參數(shù)資料
| 型號： | S75WS256NDFBAWLH2 |
| 廠商： | SPANSION LLC |
| 元件分類： | 存儲器 |
| 英文描述： | Stacked Multi-Chip Product (MCP) |
| 中文描述： | SPECIALTY MEMORY CIRCUIT, PBGA84 |
| 封裝： | 9 X 12 MM, 1.40 MM HEIGHT, FBGA-84 |
| 文件頁數(shù)： | 8/10頁 |
| 文件大小： | 123K |
| 代理商： | S75WS256NDFBAWLH2 |
6
S73WS-P based MCP Products
S73WS-P_00_A0 March 16, 2006
D a t a
S h e e t
( A d v a n c e
I n f o r m a t i o n )
4.1
Valid Combinations
Valid Combinations list configurations planned to be supported in volume for this device. Consult your local
sales office to confirm availability of specific valid combinations and to check on newly released
combinations.
Notes:
1. Packing Type 0 is standard. Specify other options as required.
2. BGA package marking omits leading
S
and packing type designator from ordering part number.
K
A
11x11 mm
112
0.45 mm
B
11x11 mm
112
0.50 mm
D
12x12 mm
128
0.45 mm
F
12x12 mm
128
0.50 mm
G
14x14 mm
152
0.45 mm
H
14x14 mm
152
0.50 mm
J
15x15 mm
160
0.45 mm
K
15x15 mm
160
0.50 mm
L
17x17 mm
192
0.45 mm
M
17x17 mm
192
0.50 mm
Table 4.1
Character Position Descriptions (Sheet 2 of 2)
Character 12
Character 13
Character 14 Description
Package Area
Package Ball Count
Raw Ball Size
S72WS-P Valid Combinations
NOR Flash
Speed
DRAM
Supplier
DRAM Speed
Package Type
Package
Markings
Base Ordering
Number
Package &
Material
Set
Package
Descriptor
Model
Number
Packing Type
S73WS512PD0
HF
6
4V
0, 2, 3
(Note 1)
66 MHz
Type 5
104 MHz
9x12 mm
(MCP)
(Note 2)
相關(guān)PDF資料 |
PDF描述 |
|---|---|
| S75WS256NDFBAWLH3 | Stacked Multi-Chip Product (MCP) |
| S75WS256NDFBAWLJ0 | Stacked Multi-Chip Product (MCP) |
| S75WS256NDFBAWLJ2 | Stacked Multi-Chip Product (MCP) |
| S75WS256NDFBAWLJ3 | Stacked Multi-Chip Product (MCP) |
| S75WS256NDFBAWNH0 | Stacked Multi-Chip Product (MCP) |
相關(guān)代理商/技術(shù)參數(shù) |
參數(shù)描述 |
|---|---|
| S75WS256NDFBAWLH3 | 制造商:SPANSION 制造商全稱:SPANSION 功能描述:Stacked Multi-Chip Product (MCP) |
| S75WS256NDFBAWLJ0 | 制造商:SPANSION 制造商全稱:SPANSION 功能描述:Stacked Multi-Chip Product (MCP) |
| S75WS256NDFBAWLJ2 | 制造商:SPANSION 制造商全稱:SPANSION 功能描述:Stacked Multi-Chip Product (MCP) |
| S75WS256NDFBAWLJ3 | 制造商:SPANSION 制造商全稱:SPANSION 功能描述:Stacked Multi-Chip Product (MCP) |
| S75WS256NDFBAWLK0 | 制造商:SPANSION 制造商全稱:SPANSION 功能描述:Stacked Multi-Chip Product (MCP) |
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