參數(shù)資料
型號(hào): S75WS256NDFBAWLH2
廠商: SPANSION LLC
元件分類: 存儲(chǔ)器
英文描述: Stacked Multi-Chip Product (MCP)
中文描述: SPECIALTY MEMORY CIRCUIT, PBGA84
封裝: 9 X 12 MM, 1.40 MM HEIGHT, FBGA-84
文件頁數(shù): 7/10頁
文件大?。?/td> 123K
代理商: S75WS256NDFBAWLH2
S73WS-P_00_A0 March 16, 2006
S73WS-P based MCP Products
5
D a t a
S h e e t
( A d v a n c e
I n f o r m a t i o n )
4.
Ordering Information
The order number is formed by a valid combinations of the following:
S73WS
512
P
D0
HF
6
4
V
0
PACKING TYPE
0 = Tray
2 = 7” Tape and Reel
3 = 13” Tape and Reel
MODEL NUMBER 2
V = 66MHz/104MHz Speed
MODEL NUMBER 1
4 = SDR DRAM x16, Type 5
PACKAGE DESCRIPTOR
Depends on Character 12. For a more detailed description see
Table 4.1
.
PACKAGE TYPE & MATERIAL SET
HF = 1.2mm MCP FBGA, Pb-free
KF = 1.2mm POP FBGA, Pb-free
JF = 1.4mm MCP FBGA, Pb-free
DRAM & ORNAND FLASH DENSITY
D0 = 128 Mb DRAM, No Data Flash
PROCESS TECHNOLOGY
P = 90 nm, MirrorBit
TM
Technology
CODE FLASH DENSITY
512 = 512Mb
PRODUCT FAMILY
S73WS Stacked Products (MCP)
1.8 V NOR Flash and Mobile DRAM
Table 4.1
Character Position Descriptions (Sheet 1 of 2)
Character 12
Character 13
Character 14 Description
Package Area
Package Ball Count
Raw Ball Size
H, J, or G
0
7x9 mm
56
0.35 mm
1
7x9 mm
80
2
8x11.6 mm
64
3
8x11.6 mm
84
4
9x12 mm
84
5
9x12 mm
115
6
9x12 mm
137
7
11x13 mm
84
8
11x13 mm
115
9
11x13 mm
137
相關(guān)PDF資料
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S75WS256NDFBAWLH3 Stacked Multi-Chip Product (MCP)
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S75WS256NDFBAWLJ2 Stacked Multi-Chip Product (MCP)
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相關(guān)代理商/技術(shù)參數(shù)
參數(shù)描述
S75WS256NDFBAWLH3 制造商:SPANSION 制造商全稱:SPANSION 功能描述:Stacked Multi-Chip Product (MCP)
S75WS256NDFBAWLJ0 制造商:SPANSION 制造商全稱:SPANSION 功能描述:Stacked Multi-Chip Product (MCP)
S75WS256NDFBAWLJ2 制造商:SPANSION 制造商全稱:SPANSION 功能描述:Stacked Multi-Chip Product (MCP)
S75WS256NDFBAWLJ3 制造商:SPANSION 制造商全稱:SPANSION 功能描述:Stacked Multi-Chip Product (MCP)
S75WS256NDFBAWLK0 制造商:SPANSION 制造商全稱:SPANSION 功能描述:Stacked Multi-Chip Product (MCP)