參數(shù)資料
型號: S71GL064A80BFW0B2
廠商: Spansion Inc.
英文描述: Stacked Multi-Chip Product (MCP) Flash Memory and RAM
中文描述: 堆疊式多芯片產(chǎn)品(MCP)的閃存和RAM
文件頁數(shù): 84/102頁
文件大?。?/td> 1606K
代理商: S71GL064A80BFW0B2
84
S71GL032A Based MCPs
S71GL032A_00_A0 March 31, 2005
A d v a n c e I n f o r m a t i o n
Table 26. Switching Characteristics
Notes:
1.
Test conditions assume signal transition time of 1V/ns or higher, timing reference levels of V
CC(typ.)
/2, input pulse levels of
0 to V
CC(typ.)
, and output loading of the specified I
OL
/I
OH
and 30 pF load capacitance.
t
HZOE
, t
HZCE
, t
HZBE
and t
HZWE
transitions are measured when the outputs enter a high-impedance state.
2.
3.
High-Z and Low-Z parameters are characterized and are not 100% tested.
4.
To achieve 55-ns performance, the read access should be CE# controlled. In this case t
ACE
is the critical parameter and t
SK
is
satisfied when the addresses are stable prior to chip enable going active. For the 70-ns cycle, the addresses must be stable
within 10 ns after the start of the read cycle.
5.
The internal write time of the memory is defined by the overlap of WE#, CE#1 = V
IL
, CE2 = V
IH
, B
HE
and/or B
LE
= V
IL
. All
signals must be Active to initiate a write and any of these signals can terminate a write by going Inactive. The data input set-
up and hold timing should be referenced to the edge of the signal that terminates write.
Parameter
Description
Min
Max
Unit
Read Cycle
t
RC
Read Cycle Time
70
ns
t
AA
Address to Data Valid
70
t
OHA
Data Hold from Address Change
10
t
ACE
CE#1 Low and CE2 High to Data Valid
70
t
DOE
OE# Low to Data Valid
35
t
LZOE
OE# Low to Low Z (note 2, 3)
5
t
HZOE
OE# High to High Z (note 2, 3)
25
t
LZCE
CE#1 Low and CE2 High to Low Z (note 2, 3)
5
t
HZCE
CE#1 High and CE2 Low to High Z (note 2, 3)
25
t
DBE
BHE# / BLE# Low to Data Valid
70
t
LZBE
BHE# / BLE# Low to Low Z (note 2, 3)
5
t
HZBE
BHE# / BLE# High to High Z (note 2, 3)
25
t
SK
(note 4)
Address Skew
10
W rite Cycle ( note 5)
t
WC
Write Cycle Time
70
ns
t
SCE
CE#1 Low an CE2 High to Write End
55
t
AW
Address Set-Up to Write End
55
t
HA
Address Hold from Write End
0
t
SA
Address Set-Up to Write Start
0
t
PWE
WE# Pulse Width
55
t
BW
BLE# / BHE# LOW to Write End
55
t
SD
Data Set-up to Write End
25
t
HD
Data Hold from Write End
0
t
HZWE
WE# Low to High Z (note 2, 3)
25
t
LZWE
WE# High to Low Z (note 2, 3)
5
相關(guān)PDF資料
PDF描述
S71GL064A80BFW0B3 Stacked Multi-Chip Product (MCP) Flash Memory and RAM
S71GL064A80BFW0F3 Stacked Multi-Chip Product (MCP) Flash Memory and RAM
S71PL254 STACKED MULTI CHIP PRODUCT FLASH MEMORY AND RAM
S71PL032J STACKED MULTI CHIP PRODUCT FLASH MEMORY AND RAM
S71PL032J04 STACKED MULTI CHIP PRODUCT FLASH MEMORY AND RAM
相關(guān)代理商/技術(shù)參數(shù)
參數(shù)描述
S71GL064A80BFW0B3 制造商:SPANSION 制造商全稱:SPANSION 功能描述:Stacked Multi-Chip Product (MCP) Flash Memory and RAM
S71GL064A80BFW0F0 制造商:SPANSION 制造商全稱:SPANSION 功能描述:Stacked Multi-Chip Product (MCP) Flash Memory and RAM
S71GL064A80BFW0F2 制造商:SPANSION 制造商全稱:SPANSION 功能描述:Stacked Multi-Chip Product (MCP) Flash Memory and RAM
S71GL064A80BFW0F3 制造商:SPANSION 制造商全稱:SPANSION 功能描述:Stacked Multi-Chip Product (MCP) Flash Memory and RAM
S71GL064AA0 制造商:SPANSION 制造商全稱:SPANSION 功能描述:STACKED MULTI CHIP PRODUCT FLASH MEMORY AND RAM