參數(shù)資料
型號(hào): PZT651T3
英文描述: TRANSISTOR | BJT | NPN | 60V V(BR)CEO | 2A I(C) | TO-261AA
中文描述: 晶體管|晶體管|叩| 60V的五(巴西)總裁|甲一(c)|至261AA
文件頁(yè)數(shù): 1/6頁(yè)
文件大?。?/td> 101K
代理商: PZT651T3
1
Motorola Small–Signal Transistors, FETs and Diodes Device Data
This NPN Silicon Epitaxial transistor is designed for use in industrial and consumer
applications. The device is housed in the SOT–223 package which is designed for
medium power surface mount applications.
High Current: 2.0 Amp
The SOT–223 package can be soldered using wave or reflow.
SOT–223 package ensures level mounting, resulting in improved thermal
conduction, and allows visual inspection of soldered joints. The formed
leads absorb thermal stress during soldering, eliminating the possibility
of damage to the die.
Available in 12 mm Tape and Reel
Use PZT651T1 to order the 7 inch/1000 unit reel
Use PZT651T3 to order the 13 inch/4000 unit reel
PNP Complement is PZT751T1
MAXIMUM RATINGS
(TC = 25
°
C unless otherwise noted)
Rating
Symbol
Value
Unit
Collector–Emitter Voltage
VCEO
VCBO
VEBO
IC
PD
60
Vdc
Collector–Base Voltage
80
Vdc
Emitter–Base Voltage
5.0
Vdc
Collector Current
Total Power Dissipation @ TA = 25
°
C(1)
Derate above 25
°
C
2.0
Adc
0.8
6.4
Watts
mW/
°
C
Storage Temperature Range
Tstg
TJ
–65 to 150
°
C
Junction Temperature
150
°
C
DEVICE MARKING
651
THERMAL CHARACTERISTICS
Characteristic
Symbol
Max
Unit
Thermal Resistance from Junction–to–Ambient in Free Air
R
θ
JA
TL
156
°
C/W
Maximum Temperature for Soldering Purposes
Time in Solder Bath
260
10
°
C
Sec
1. Device mounted on a FR–4 glass epoxy printed circuit board using minimum recommended footprint.
Preferred
devices are Motorola recommended choices for future use and best overall value.
Thermal Clad is a trademark of the Bergquist Company
Order this document
by PZT651T1/D
SEMICONDUCTOR TECHNICAL DATA
SOT–223 PACKAGE
HIGH CURRENT
NPN SILICON
TRANSISTOR
SURFACE MOUNT
Motorola Preferred Device
CASE 318E–04, STYLE 1
TO–261AA
1
2
3
4
COLLECTOR 2,4
BASE
1
EMITTER 3
REV 1
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