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參數(shù)資料
| 型號(hào)： | PPC440GX-3CC533S |
| 廠商： | APPLIEDMICRO INC |
| 元件分類： | 微控制器/微處理器 |
| 英文描述： | Power PC 440GX Embedded Processor |
| 中文描述： | 32-BIT, 533 MHz, RISC PROCESSOR, CBGA552 |
| 封裝： | 25 X 25 MM, CERAMIC, FBGA-552 |
| 文件頁(yè)數(shù)： | 59/93頁(yè) |
| 文件大?。?/td> | 794K |
| 代理商： | PPC440GX-3CC533S |
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440GX – Power PC 440GX Embedded Processor
AMCC
59
Revision 1.15 – August 30, 2007
Data Sheet
Package Thermal Specifications
Thermal resistance values for the CBGA and PBGA packages in a convection environment are as follows:
Parameter
Symbol
Package
Airflow
ft/min (m/sec)
Unit
Notes
0 (0)
100 (0.51)
200 (1.02)
Junction-to-case thermal resistance
θ
JC
Ceramic
<0.1
<0.1
<0.1
°C/W
1
Plastic
1.2
1.2
1.2
°C/W
1, 3
Case-to-ambient thermal resistance (w/o heat
sink)
θ
CA
Ceramic
18.9
17.7
16.3
°C/W
2
Plastic
20.8
°C/W
2, 3
Range
Min
Nom
Max
Junction-to-ball (typical)
θ
JB
Ceramic
1.5
2.2
°C/W
4
Plastic
8.2
°C/W
Notes:
1. Case temperature, T
C
, is measured at top center of case surface with device soldered to circuit board.
2. The case-to-ambient thermal resistance is measured in a JEDEC JESD51-6 standard environment; and may not accurately predict
thermal performance in production equipment environments. The operational case temperature must be maintained.
3. Modeled on standard JEDEC 2S2P card, 50x50mm
4. 1.5 °C/W is the theoretical
θ
JB
using an infinite heat sink. The larger number applies to the module mounted on a 1.8mm thick, 2P card
using 1oz. copper power planes, with an effective heat transfer area of 75mm
2
.
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相關(guān)代理商/技術(shù)參數(shù) |
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| PPC440GX-3CC667C | 制造商:AppliedMicro 功能描述: |
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| PPC440GX-3CF533C | 制造商:AMCC 制造商全稱:Applied Micro Circuits Corporation 功能描述:Power PC 440GX Embedded Processor |
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