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參數(shù)資料
| 型號： | PPC440GP-3RC466CZ |
| 廠商： | APPLIEDMICRO INC |
| 元件分類： | 微控制器/微處理器 |
| 英文描述： | Power PC 440GP Embedded Processor |
| 中文描述： | 32-BIT, 466 MHz, RISC PROCESSOR, CBGA552 |
| 封裝： | 25 X 25 MM, ROHS COMPLIANT, CERAMIC, BGA-552 |
| 文件頁數(shù)： | 57/83頁 |
| 文件大?。?/td> | 773K |
| 代理商： | PPC440GP-3RC466CZ |
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440GP – Power PC 440GP Embedded Processor
AMCC
57
Revision 1.07 – October 4, 2007
Data Sheet
Heat Sink Mounting Information (Ceramic Package Only)
Proper thermal design is primarily dependent upon multiple system-level effects; that is, the effects of the heat
sink, the air flow, and the thermal interface material. To reduce the die-junction temperature, heat sinks may be
attached to the package by several methods: adhesive, spring clips to the printed-circuit board or package, or a
mounting clip and screw assembly. When attaching heat sinks, it is important to avoid placing excessive
mechanical stress on bonding of the chip to the substrate and the package to the board.
Heat Sink Attached With Spring Clip
Heat Sink Attached With Adhesive
Important:
All of the guidelines indicated in the above diagrams must be evaluated and adjusted to account for the
shock and vibration effects of any particular application.
Heat sink
Heat sink clip
Thermal grease
Printed
circuit
board
CBGA
package
Heat sink
Heat sink clip
Printed
circuit
board
CBGA
package
Spring clip to board
Spring clip to package
Thermal grease
Static compression (spring force)—2.27kg maximum
Static compression (spring force)—2.27kg maximum
1
Note 1:
Force is limited by allowable compression on the die.
Allowable package compression force is 4.4kg.
Heat sink
Printed
circuit
board
CBGA
package
Adhesive
Heat sink
Printed
circuit
board
CBGA
package
Adhesive
Heat sink weight force—60g maximum
Weight
force
Weight
force
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