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參數(shù)資料
| 型號： | PowerPC 604 |
| 廠商： | Motorola, Inc. |
| 英文描述： | 32-Bit Microprocessor(32位微處理器) |
| 中文描述： | 32位微處理器（32位微處理器） |
| 文件頁數(shù)： | 4/7頁 |
| 文件大?。?/td> | 203K |
| 代理商： | POWERPC 604 |
0
5
10
15
20
25
30
M
°
C
Computer Platforms
Laptop
Personal
Computer
Workstation
Network Server
Figure 3
. Printed-circuit Board Temperature Rise Above
Ambient for Various Computer Systems
Excluding, the laptop computer, all other
computer systems had forced-convection
cooling systems, which resulted in linear air
velocities of 0.5 to 2 m/s.
Reliability Test Vehicle.
Substrates (21mm and 25mm) used to study CBGA
solder joint reliability were designed to mate to a PCB so
that each interconnection element between the substrate
and PCB could be monitored electrically. Each
connection to the PCB was monitored continuously during
thermal cycle testing. The daisy-chain pattern on the
substrate has connections made without using a C4 chip;
therefore, a co-fired conductor layer is used to provide the
interconnections. This technique is preferred for
independent testing of the CBGA joints over others
because it isolates the board interconnections (and not the
other connections internal to the package). PCBs were
coated with both hot air solder leveling (HASL) and
organic (benzotriazole) coating process. The PCBs used
were 4-layer epoxy-glass, 1.57 mm (62 mils) thick and
characterized to have a glass-transition temperature (Tg) of
118
°
C minimum and a thermal-expansion coefficient of 21
ppm/
°
C in the array site (18 ppm/
°
C in the base material)
Gerke (1994). Figure 5 illustrates the localized TCE effect
that the metallization (i.e. plated through holes) in the PCB
can have relative to making calculations for solder fatigue.
Accelerated air-to-air temperature cycle testing for
CBGA joints were cycled over a range of 20
°
C to 80
°
C (at
3 cycles per hour) on a sample of 40 packages for the
25mm packages and 0
°
C to 100
°
C (at 1.5 cycles per hour)
for the 21mm packages. Details for both tests have been
documented Banks et al. (1994) and Gerke (1994). For
illustrative purposes, the fatigue-life results of the 20
°
C to
80
°
C testing is presented in Figure 6. The CBGA wear-out
F
4
Maximum Board Temperature Rise (C)
8
12
16
20
24
28
32
36
40
Mean
0
1
2
3
4
5
0
Figure 4
. Distribution of Temperature Rise Data.
80
°
C testing is presented in Figure 6. The CBGA wear-out
mechanism follows a log-normal distribution. Final
separation is characterized as a primary crack propagating
through the eutectic solder at the PWB side of the high-
lead ball as verified by cross-sectioning.
Module-To-Board Reliability
In consideration of the system-level thermal design
options presented, the
T's presented in this section are
considered to be typical and upper bounds that may be
expected during product use, 25 - 45
°
C and 25 - 55
°
C;
respectively. Thermal excursions occur through on-off
cycles. The greatest reliability concern in the C4/CBGA
packaging technology is solder fatigue in the CBGA joints
during these thermal excursions. Small
T's associated
with the interconnect joint equate to longer life when
compared to large
T's. Therefore, thermal management
design can influence the solder joint temperature rise
(
T's).
CTE
(ppm/
°
C)
20a - 21b
18
21 mm
a non solder-filled plated through holes
b solder-filled plated through holes
Figure 5.
In-plane TCE distributions of a 4 layer printed
wiring board determined by thermal mechanical
analysis (TMA) (Gerke 1994).
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