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參數(shù)資料
| 型號： | PowerPC 604 |
| 廠商： | Motorola, Inc. |
| 英文描述： | 32-Bit Microprocessor(32位微處理器) |
| 中文描述： | 32位微處理器（32位微處理器） |
| 文件頁數(shù)： | 2/7頁 |
| 文件大小： | 203K |
| 代理商： | POWERPC 604 |
Objective
To predict solder joint reliability of surface-mount
interconnect technologies, such as the CBGA, a key
parameter is the: temperature rise above ambient of the
solder joint. This data is often not available in the open
literature and/or the system "worst-case" temperatures are
often used. Therefore, field-temperature measurements at
or near the central-processing unit (CPU) were taken for a
variety of computer platforms under typical office use. In
addition, as printed-circuit boards (PCBs) are not uniform,
the objective was to identify, the
maximum
board
temperature.
The results of the maximum field-temperature
measurements, were used to predict package-to-board
reliability solder-fatigue lifetime for initial C4/CGBA
offerings of the PowerPC microprocessor product family;
the PowerPC 603 and PowerPC 604 microprocessors and
the MPC105. The solder fatigue lifetime will be presented
for failure rates of 100ppm and 1000ppm (per package) for
field conditions of 365 days usage per year with up to 6
on/off cycles per day.
C4-Ceramic-Ball-Grid Array Module
Computer system performance has dramatically
improved over the past three decades. Much of this
improvement is a result of increased integration of
components at the semiconductor level, made possible by
reduced feature sizes. These reduced feature sizes have
resulted in several semiconductor integrated-circuit (IC)
trends, all of which are increasing: gate count, chip
inputs/outputs, chip size, operating frequency, and power
consumption. In summary, these trends have placed an
increased emphasis on microelectronics packaging design.
To satisfy customer requirements for surface mountable
packages with reduced size, the C4/CBGA format was
chosen. The C4 technology has a long history of producing
reliable product at International Business Machines
Corporation. Work has been performed at Motorola that
supports the International Business Machines Corporation
data; therefore, the C4 joint reliability is not discussed in
this report. Motorola has supplied customers with ceramic
ball-grid-array packages for many years, primarily in the
Land Mobile Products Sector (LMPS). In contrast to the
PowerPC microprocessor family packages, these packages
are small in size and lead count (100 I/O and below). The
packages chosen for the PowerPC microprocessor family
are larger in size and lead count (21mm, 255 I/O's,
minimum).
This paper presents the solder fatigue life projections for
the first three CBGA PowerPC microprocessor products
that will be introduced by Motorola; that is, the PowerPC
603 and PowerPC 604 microprocessors in 21mm CBGA
and the MPC105 in a 21mmx25mm CBGA. This
interconnect technology has been previously described by
Kromann, et al. (1994), Kromann (1994), Gerke (1994)
and Motorola C4 Packaging Manuals (1993 & 1994).
Printed-circuit Board Temperatures of Computer
Systems
In-situ field-temperature measurements at or near the
central-processing unit (CPU) were taken for a variety of
operating computer platforms under typical office use. We
wished to identify maximum printed-circuit board (PCB)
temperatures for the following computer systems:
Notebooks/Laptops
Personal Computers
Workstations
Servers
Temperature Measurement Procedure.
Temperature
probing an operating computer system is an arduous task.
One must use caution to avoid: electro-static discharge,
electrical shorting, and contact with component/system air-
mover blades. To avoid electrical shorting, probing the
solder joint was not possible; therefore, PCB regions at or
near the CPU were measured. The typical measurement
procedure was as follows:
The computer cabinets were opened and maximum
temperatures were identified, while the machine
was operating.
The computer cabinets were replaced and the
machines dynamically stressed.
The CPUs were active and the usual monitoring
took more than three hours.
Temperatures were measured with a very fine-
gauge thermocouple taped and thermally
grounded by at least 3 cm along the point of
interest.
Multiple readings were recorded and only the
maximum temperature is reported.
For dual-processor systems, data for the highest
temperature CPU is reported.
In some cases the maximum board temperature
was not at the CPU. This data is also presented.
Data is estimated to be within 5% error.
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