參數(shù)資料
型號: PM50B4LA060
廠商: Mitsubishi Electric Corporation
英文描述: FLAT-BASE TYPE INSULATED PACKAGE
中文描述: 平性基地型絕緣包裝
文件頁數(shù): 1/8頁
文件大?。?/td> 155K
代理商: PM50B4LA060
Oct. 2005
MITSUBISHI <INTELLIGENT POWER MODULES>
PM50B4LA060
FLAT-BASE TYPE
INSULATED PACKAGE
PM50B4LA060
FEATURE
a) Adopting new 5th generation IGBT (CSTBT
TM
) chip, which
performance is improved by 1
μ
m fine rule process.
For example, typical V
ce
(sat)=1.55V @Tj=125
°
C
b) Over-temperature protection by detecting Tj of the CSTBT
TM
chips and error output is possible from all each conserva-
tion upper and lower arm of IPM.
c) New small package
Reduce the package size by 10%, thickness by 22% from
S-DASH series.
2
φ
50A, 600V Current-sense IGBT type inverter
Monolithic gate drive & protection logic
Detection, protection & status indication circuits for, short-
circuit, over-temperature & under-voltage (P-Fo available
from upper arm devices)
UL Recognized
Yellow Card No.E80276(N)
File No.E80271
APPLICATION
Photo voltaic power conditioner
PACKAGE OUTLINES
Dimensions in mm
1. VUPC
2. UFO
3. UP
4. VUP1
5. VVPC
6. VFO
7. VP
15. NC
16. UN
17. VN
18. NC
19. Fo
8. VVP1
9. NC
10. NC
11. NC
12. NC
13. VNC
14. VN1
Terminal code
106
19.75
3.25
7
16
15.25
2-
φ
5.5
MOUNTING HOLES
6-M5 NUTS
L
6-2
3-2
3-2
3-2
B
N
P
U
V
W
10.75
7
1
(
19-
0.5
32.75
23
23
23
1
3
5
1
3
1
3
16
1
1
(19.75)
1
1
16
16
120
11
1
5
9
13
19
12
22
+
–1
0.5
2
φ
2
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