參數(shù)資料
型號: PM50B6LA060
廠商: Mitsubishi Electric Corporation
英文描述: FLAT-BASE TYPE INSULATED PACKAGE
中文描述: 平性基地型絕緣包裝
文件頁數(shù): 1/10頁
文件大?。?/td> 186K
代理商: PM50B6LA060
Oct. 2005
MITSUBISHI <INTELLIGENT POWER MODULES>
PM50B6LA060
FLAT-BASE TYPE
INSULATED PACKAGE
PM50B6LA060
FEATURE
a) Adopting new 5th generation IGBT (CSTBT
TM
) chip, which
performance is improved by 1
μ
m fine rule process.
For example, typical V
ce
(sat)=1.55V @Tj=125
°
C
b) Over-temperature protection by detecting Tj of the CSTBT
TM
chips and error output is possible from all each conserva-
tion upper and lower arm of IPM.
c) New small package
Reduce the package size by 10%, thickness by 22% from
S-DASH series.
2
φ
50A, 600V Current-sense IGBT type inverter
50A, 600V Current-sense Chopper IGBT
Monolithic gate drive & protection logic
Detection, protection & status indication circuits for, short-
circuit, over-temperature & under-voltage (P-Fo available
from upper arm devices)
UL Recognized
Yellow Card No.E80276(N)
File No.E80271
APPLICATION
Photo voltaic power conditioner
PACKAGE OUTLINES
Dimensions in mm
1. VUPC
2. UFO
3. UP
4. VUP1
5. VVPC
6. VFO
7. VP
15. Br
16. UN
17. VN
18. WN
19. Fo
8. VVP1
9. NC
10. NC
11. NC
12. NC
13. VNC
14. VN1
Terminal code
106
19.75
3.25
7
16
15.25
2-
φ
5.5
MOUNTING HOLES
6-M5 NUTS
L
6-2
3-2
3-2
3-2
B
N
P
U
V
W
10.75
7
1
(
19-
0.5
32.75
23
23
23
1
3
5
1
3
1
3
16
1
1
(19.75)
1
1
16
16
120
11
1
5
9
13
19
12
22
+
–1
0.5
2
φ
2
相關(guān)PDF資料
PDF描述
PM50B6LB060 FLAT-BASE TYPE INSULATED PACKAGE
PM50CLA060 FLAT-BASE TYPE INSULATED PACKAGE
PM50CLA120 FLAT-BASE TYPE INSULATED PACKAGE
PM50CLA120_05 FLAT-BASE TYPE INSULATED PACKAGE
PM50CLB120_05 FLAT-BASE TYPE INSULATED PACKAGE
相關(guān)代理商/技術(shù)參數(shù)
參數(shù)描述
PM50B6LA060_09 制造商:MITSUBISHI 制造商全稱:Mitsubishi Electric Semiconductor 功能描述:FLAT-BASE TYPE INSULATED PACKAGE
PM50B6LB060 功能描述:MOD PV-IPM H-BRDG/2CHOP 600V 50A RoHS:是 類別:半導(dǎo)體模塊 >> 功率驅(qū)動器 系列:Intellimod™ 標準包裝:15 系列:SPM® 類型:FET 配置:三相反相器 電流:1.8A 電壓:500V 電壓 - 隔離:1500Vrms 封裝/外殼:23-DIP 模塊
PM50B6LB060_09 制造商:MITSUBISHI 制造商全稱:Mitsubishi Electric Semiconductor 功能描述:FLAT-BASE TYPE INSULATED PACKAGE
PM50CBS060 制造商:POWEREX 制造商全稱:Powerex Power Semiconductors 功能描述:Intellimod⑩ Module MAXISS Series⑩ Multi AXIS Servo IPM (50 Amperes/600 Volts)
PM50CL1A060 制造商:Powerex Power Semiconductors 功能描述:MOD IPM 6-PAC L1 50A 600V 制造商:Powerex Power Semiconductors 功能描述:IGBT MODULE, 600V, 50A; Transistor Polarity:N Channel; DC Collector Current:50A; Collector Emitter Voltage Vces:600V; Power Dissipation Pd:284W; Collector Emitter Voltage V(br)ceo:600V; Operating Temperature Min:-20C; No. of Pins:25;RoHS Compliant: Yes 制造商:Powerex Power Semiconductors 功能描述:POWER IGBT TRANSISTOR