參數(shù)資料
型號: PIP201-12M-3,518
廠商: NXP SEMICONDUCTORS
元件分類: 穩(wěn)壓器
英文描述: 200 A SWITCHING REGULATOR, PQCC68
封裝: 10 X 10 MM, 0.85 MM HEIGHT, PLASTIC, SOT-687-1, HVQFN-68
文件頁數(shù): 9/20頁
文件大?。?/td> 345K
代理商: PIP201-12M-3,518
Philips Semiconductors
PIP201-12M-3
DC-to-DC converter powertrain
Product data
Rev. 03 — 19 November 2003
17 of 20
9397 750 11942
Koninklijke Philips Electronics N.V. 2003. All rights reserved.
16.2 Solder paste printing
The process of printing the solder paste requires care because of the ne pitch and
small size of the solder lands. A stencil thickness of 0.125 mm is recommended. The
stencil apertures can be made the same size as the solder lands in Figure 20.
The type of solder paste recommended for MLF packages is “No clean”, Type 3, due
to the difculty of cleaning ux residues from beneath the MLF package.
All dimensions in mm.
Fig 20. PCB footprint for SOT687-1 package (reow soldering).
0.4 SP (2
×)
11.15 OA
(2
×)
7.6 Cu
(2
×)
10.8 Cu
(2
×)
0.9 SP
(10
×)
0.5 SP
(4
×)
1 SP
(10
×)
8.9 Cu
(2
×)
1 SP
(8
×)
1 SP
(8
×)
0.28 Cu (68
×)
0.4 SP
0.6 Cu
4.1
8.63 OA
(4
×)
4.1
0.6 Cu
e = 0.5
MGW820
solder lands
Cu pattern
clearance
solder paste
occupied area
0.1
0.2
0.02
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