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| 型號： | PIP201-12M-3,518 |
| 廠商： | NXP SEMICONDUCTORS |
| 元件分類： | 穩(wěn)壓器 |
| 英文描述： | 200 A SWITCHING REGULATOR, PQCC68 |
| 封裝： | 10 X 10 MM, 0.85 MM HEIGHT, PLASTIC, SOT-687-1, HVQFN-68 |
| 文件頁數(shù)： | 7/20頁 |
| 文件大?。?/td> | 345K |
| 代理商： | PIP201-12M-3,518 |
Philips Semiconductors
PIP201-12M-3
DC-to-DC converter powertrain
Product data
Rev. 03 — 19 November 2003
15 of 20
9397 750 11942
Koninklijke Philips Electronics N.V. 2003. All rights reserved.
15. Soldering
15.1 Introduction to soldering MLF packages
The MicroLeadFrame package (MLF) is a near Chip Scale Package (CSP) with a
copper leadframe. It is a leadless package, where electrical contact to the printed
circuit board is made through metal pads on the underside of the package. In addition
to the small pads around the periphery of the package, there are large pads on the
underside that provide low thermal resistance, low electrical resistance, low
inductance connections between the power components inside the MLF package and
the printed-circuit board. It is this feature of the MLF package that makes it ideally
suited for VRM applications.
Electrical connection between the package and the printed circuit board is made by
printing solder paste on the printed circuit board, placing the component and
reowing the solder in a convection or infra-red oven. The solder reow process is
ensure good solder joints, the peak temperature Tp should not exceed 220 °C for thin
packages such as MLF, and the time above liquidus temperature should be less than
1.25 minutes. The maximum temperature can be increased for lead free solder. The
ramp rate during preheat should not exceed 3 K/s. Nitrogen purge is recommended
during reow.
Fig 18. Typical reow soldering process ow.
Fig 19. Typical reow soldering temperature prole.
SOLDER PASTE
PRINTING
POST PRINT
INSPECTION
COMPONENT
PLACEMENT
PRE REFLOW
INSPECTION
REFLOW SOLDERING
POST REFLOW INSPECTION
(PREFERABLY X-RAY)
REWORK AND
TOUCH UP
03aj25
03aj26
0
100
200
300
01
23
time (minutes)
Temp
Tr
Te
Tp
rate of rise of
temperature < 3 K/s
1 min max
1.25 min max
(
°C)
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相關(guān)代理商/技術(shù)參數(shù) |
參數(shù)描述 |
|---|---|
| PIP202-12M | 制造商:PHILIPS 制造商全稱:NXP Semiconductors 功能描述:DC to DC converter powertrain |
| PIP202-12M-2 | 制造商:PHILIPS 制造商全稱:NXP Semiconductors 功能描述:DC-to-DC converter powertrain |
| PIP202-12M-2 /T3 | 功能描述:直流/直流開關(guān)轉(zhuǎn)換器 TAPE7 MOSFET RoHS:否 制造商:STMicroelectronics 最大輸入電壓:4.5 V 開關(guān)頻率:1.5 MHz 輸出電壓:4.6 V 輸出電流:250 mA 輸出端數(shù)量:2 最大工作溫度:+ 85 C 安裝風(fēng)格:SMD/SMT |
| PIP202-12M-2,518 | 功能描述:直流/直流開關(guān)調(diào)節(jié)器 TAPE7 MOSFET RoHS:否 制造商:International Rectifier 最大輸入電壓:21 V 開關(guān)頻率:1.5 MHz 輸出電壓:0.5 V to 0.86 V 輸出電流:4 A 輸出端數(shù)量: 最大工作溫度: 安裝風(fēng)格:SMD/SMT 封裝 / 箱體:PQFN 4 x 5 |
| PIP20-5,08 | 功能描述:可插拔接線端子 PCB Hdr, 45 Deg, 5,08 PitchClosed End,20pole,12A,300V,Grn RoHS:否 制造商:Phoenix Contact 產(chǎn)品:Plugs 系列:PTS 端接類型:Spring Cage 位置/觸點(diǎn)數(shù)量:5 線規(guī)量程:26-14 節(jié)距:5 mm 電流額定值:10 A 電壓額定值:250 V 安裝風(fēng)格: 安裝角: 觸點(diǎn)電鍍: |
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