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PIC18FXX2
DS39564A-page 26
Advance Information
2001 Microchip Technology Inc.
3.1
Power-On Reset (POR)
A Power-on Reset pulse is generated on-chip when
V
DD
rise is detected. To take advantage of the POR cir-
cuitry, just tie the MCLR pin directly (or through a resis-
tor) to V
DD
. This will eliminate external RC components
usually needed to create a Power-on Reset delay. A
minimum rise rate for V
DD
is specified (parameter
D004). For a slow rise time, see Figure 3-2.
When the device starts normal operation (i.e., exits the
RESET condition), device operating parameters (volt-
age, frequency, temperature, etc.) must be met to
ensure operation. If these conditions are not met, the
device must be held in RESET until the operating
conditions are met.
FIGURE 3-2:
EXTERNAL POWER-ON
RESET CIRCUIT (FOR
SLOW V
DD
POWER-UP)
3.2
Power-up Timer (PWRT)
The Power-up Timer provides a fixed nominal time-out
(parameter #33) only on power-up from the POR. The
Power-up Timer operates on an internal RC oscillator.
The chip is kept in RESET as long as the PWRT is
active. The PWRT
’
s time delay allows V
DD
to rise to an
acceptable level. A configuration bit is provided to
enable/disable the PWRT.
The power-up time delay will vary from chip-to-chip due
to V
DD
, temperature and process variation. See DC
parameter #33 for details.
3.3
Oscillator Start-up Timer (OST)
The Oscillator Start-up Timer (OST) provides 1024
oscillator cycle (from OSC1 input) delay after the
PWRT delay is over (parameter #32). This ensures that
the crystal oscillator or resonator has started and
stabilized.
The OST time-out is invoked only for XT, LP and HS
modes and only on Power-on Reset or wake-up from
SLEEP.
3.4
PLL Lock Time-out
With the PLL enabled, the time-out sequence following
a Power-on Reset is different from other oscillator
modes. A portion of the Power-up Timer is used to pro-
vide a fixed time-out that is sufficient for the PLL to lock
to the main oscillator frequency. This PLL lock time-out
(T
PLL
) is typically 2 ms and follows the oscillator start-
up time-out (OST).
3.5
Brown-out Reset (BOR)
A configuration bit, BOREN, can disable (if clear/
programmed) or enable (if set) the Brown-out Reset cir-
cuitry. If V
DD
falls below parameter D005 for greater
than parameter #35, the brown-out situation will reset
the chip. A RESET may not occur if V
DD
falls below
parameter D005 for less than parameter #35. The chip
will remain in Brown-out Reset until V
DD
rises above
BV
DD
. If the Power-up Timer is enabled, it will be
invoked after V
DD
rises above BV
DD
; it then will keep
the chip in RESET for an additional time delay (param-
eter #33). If V
DD
drops below BV
DD
while the Power-up
Timer is running, the chip will go back into a Brown-out
Reset and the Power-up Timer will be initialized. Once
V
DD
rises above BV
DD
, the Power-up Timer will exe-
cute the additional time delay.
3.6
Time-out Sequence
On power-up, the time-out sequence is as follows:
First, PWRT time-out is invoked after the POR time
delay has expired. Then, OST is activated. The total
time-out will vary based on oscillator configuration and
the status of the PWRT. For example, in RC mode with
the PWRT disabled, there will be no time-out at all.
Figure 3-3, Figure 3-4, Figure 3-5, Figure 3-6 and
Figure 3-7 depict time-out sequences on power-up.
Since the time-outs occur from the POR pulse, if MCLR
is kept low long enough, the time-outs will expire.
Bringing MCLR high will begin execution immediately
(Figure 3-5). This is useful for testing purposes or to
synchronize more than one PIC18FXXX device operat-
ing in parallel.
Table 3-2 shows the RESET conditions for some
Special Function Registers, while Table 3-3 shows the
RESET conditions for all the registers.
Note
1:
External Power-on Reset circuit is required
only if the V
DD
power-up slope is too slow.
The diode D helps discharge the capacitor
quickly when V
DD
powers down.
2:
R < 40 k
is recommended to make sure that
the voltage drop across R does not violate
the device
’
s electrical specification.
3:
R1 = 100
to 1 k
will limit any current flow-
ing into MCLR from external capacitor C, in
the event of MCLR/V
PP
pin breakdown due to
Electrostatic Discharge (ESD) or Electrical
Overstress (EOS).
C
R1
R
D
V
DD
MCLR
PIC18FXXX