參數(shù)資料
型號(hào)： PCF85176T
廠商： NXP SEMICONDUCTORS
元件分類： 顯示驅(qū)動(dòng)器
英文描述： Universal LCD driver for low multiplex rates
中文描述： LIQUID CRYSTAL DISPLAY DRIVER, PDSO56
封裝： 6.10 MM, PLASTIC, MO-153, SOT364-1, TSSOP-56
文件頁(yè)數(shù)： 41/47頁(yè)
文件大小： 405K
代理商： PCF85176T
PCF85176
All information provided in this document is subject to legal disclaimers.
NXP B.V. 2011. All rights reserved.
Product data sheet
Rev. 2 — 27 June 2011
41 of 47
NXP Semiconductors
PCF85176
Universal LCD driver for low multiplex rates
15. Handling information
All input and output pins are protected against ElectroStatic Discharge (ESD) under
normal handling. When handling Metal-Oxide Semiconductor (MOS) devices ensure that
all normal precautions are taken as described in
JESD625-A
,
IEC61340-5
or equivalent
standards.
16. Soldering of SMD packages
This text provides a very brief insight into a complex technology. A more in-depth account
of soldering ICs can be found in Application Note
AN10365 “Surface mount reflow
soldering description”
.
16.1 Introduction to soldering
Soldering is one of the most common methods through which packages are attached to
Printed Circuit Boards (PCBs), to form electrical circuits. The soldered joint provides both
the mechanical and the electrical connection. There is no single soldering method that is
ideal for all IC packages. Wave soldering is often preferred when through-hole and
Surface Mount Devices (SMDs) are mixed on one printed wiring board; however, it is not
suitable for fine pitch SMDs. Reflow soldering is ideal for the small pitches and high
densities that come with increased miniaturization.
16.2 Wave and reflow soldering
Wave soldering is a joining technology in which the joints are made by solder coming from
a standing wave of liquid solder. The wave soldering process is suitable for the following:
Through-hole components
Leaded or leadless SMDs, which are glued to the surface of the printed circuit board
Not all SMDs can be wave soldered. Packages with solder balls, and some leadless
packages which have solder lands underneath the body, cannot be wave soldered. Also,
leaded SMDs with leads having a pitch smaller than ~0.6 mm cannot be wave soldered,
due to an increased probability of bridging.
The reflow soldering process involves applying solder paste to a board, followed by
component placement and exposure to a temperature profile. Leaded packages,
packages with solder balls, and leadless packages are all reflow solderable.
Key characteristics in both wave and reflow soldering are:
Board specifications, including the board finish, solder masks and vias
Package footprints, including solder thieves and orientation
The moisture sensitivity level of the packages
Package placement
Inspection and repair
Lead-free soldering versus SnPb soldering
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相關(guān)代理商/技術(shù)參數(shù)
參數(shù)描述
PCF85176T/1,118 功能描述:LCD 驅(qū)動(dòng)器 40 SGMT 2640Hz RoHS:否 制造商:Maxim Integrated 數(shù)位數(shù)量:4.5 片段數(shù)量:30 最大時(shí)鐘頻率:19 KHz 工作電源電壓:3 V to 3.6 V 最大工作溫度:+ 85 C 最小工作溫度:- 20 C 封裝 / 箱體:PDIP-40 封裝:Tube
PCF8522EP 制造商:未知廠家 制造商全稱:未知廠家 功能描述:I2C Serial EEPROM
PCF8522ET 制造商:未知廠家 制造商全稱:未知廠家 功能描述:I2C Serial EEPROM
PCF8523 制造商:PHILIPS 制造商全稱:NXP Semiconductors 功能描述:Real-Time Clock (RTC) and calendar
PCF8523T 制造商:PHILIPS 制造商全稱:NXP Semiconductors 功能描述:Save power with small, ultra-efficient RTCs
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