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| 型號： | PCA9509 |
| 廠商： | NXP Semiconductors N.V. |
| 英文描述： | Level translating I2C-bus/SMBus repeater |
| 中文描述： | 級別翻譯I2C-bus/SMBus中繼器 |
| 文件頁數(shù)： | 14/16頁 |
| 文件大?。?/td> | 92K |
| 代理商： | PCA9509 |
PCA9509_1
Koninklijke Philips Electronics N.V. 2006. All rights reserved.
Product data sheet
Rev. 01 — 27 June 2006
14 of 16
Philips Semiconductors
PCA9509
Level translating I
2
C-bus/SMBus repeater
[3]
These transparent plastic packages are extremely sensitive to reflow soldering conditions and must on no
account be processed through more than one soldering cycle or subjected to infrared reflow soldering with
peak temperature exceeding 217
°
C
±
10
°
C measured in the atmosphere of the reflow oven. The package
body peak temperature must be kept as low as possible.
[4]
These packages are not suitable for wave soldering. On versions with the heatsink on the bottom side, the
solder cannot penetrate between the printed-circuit board and the heatsink. On versions with the heatsink
on the top side, the solder might be deposited on the heatsink surface.
[5]
If wave soldering is considered, then the package must be placed at a 45
°
angle to the solder wave
direction. The package footprint must incorporate solder thieves downstream and at the side corners.
[6]
Wave soldering is suitable for LQFP, QFP and TQFP packages with a pitch (e) larger than 0.8 mm; it is
definitely not suitable for packages with a pitch (e) equal to or smaller than 0.65 mm.
[7]
Wave soldering is suitable for SSOP, TSSOP, VSO and VSSOP packages with a pitch (e) equal to or larger
than 0.65 mm; it is definitely not suitable for packages with a pitch (e) equal to or smaller than 0.5 mm.
[8]
Image sensor packages in principle should not be soldered. They are mounted in sockets or delivered
pre-mounted on flex foil. However, the image sensor package can be mounted by the client on a flex foil by
using a hot bar soldering process. The appropriate soldering profile can be provided on request.
[9]
Hot bar soldering or manual soldering is suitable for PMFP packages.
14. Abbreviations
15. Revision history
Table 9.
Acronym
CDM
CMOS
CPU
ESD
HBM
I/O
I
2
C-bus
MM
NMOS
RC
SMBus
Abbreviations
Description
Charged Device Model
Complementary Metal Oxide Semiconductor
Central Processing Unit
ElectroStatic Discharge
Human Body Model
Input/Output
Inter-Integrated Circuit bus
Machine Model
Negative-channel Metal Oxide Semiconductor
Resistor-Capacitor network
System Management Bus
Table 10.
Document ID
PCA9509_1
Revision history
Release date
20060627
Data sheet status
Product data sheet
Change notice
-
Supersedes
-
相關(guān)PDF資料 |
PDF描述 |
|---|---|
| PCA9510A | Hot swappable I2C-bus and SMBus bus buffer |
| PCA9511A | Hot swappable I2C-bus and SMBus bus buffer |
| PCA9511DP | Hot swappable I2C and SMBus bus buffer |
| PCA9510 | Hot swappable I2C and SMBus bus buffer |
| PCA9510D | Hot swappable I2C and SMBus bus buffer |
相關(guān)代理商/技術(shù)參數(shù) |
參數(shù)描述 |
|---|---|
| PCA9509A | 制造商:PHILIPS 制造商全稱:NXP Semiconductors 功能描述:Smart, simple solutions for the 12 most common design concerns |
| PCA9509ADP,118 | 功能描述:接口-信號緩沖器、中繼器 I2CbusSMBus repeater RoHS:否 制造商:Texas Instruments 工作電源電壓: 工作溫度范圍: 安裝風(fēng)格:SMD/SMT 封裝 / 箱體:VSSOP-8 封裝:Reel |
| PCA9509ADP118 | 制造商:Rochester Electronics LLC 功能描述: 制造商:NXP 功能描述: 制造商:NXP Semiconductors 功能描述: |
| PCA9509AGM,125 | 功能描述:接口-信號緩沖器、中繼器 I2CbusSMBus repeater RoHS:否 制造商:Texas Instruments 工作電源電壓: 工作溫度范圍: 安裝風(fēng)格:SMD/SMT 封裝 / 箱體:VSSOP-8 封裝:Reel |
| PCA9509D | 功能描述:接口-信號緩沖器、中繼器 I2C LV LVL TRANSLATR RoHS:否 制造商:Texas Instruments 工作電源電壓: 工作溫度范圍: 安裝風(fēng)格:SMD/SMT 封裝 / 箱體:VSSOP-8 封裝:Reel |
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