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參數(shù)資料
| 型號： | PCA9509 |
| 廠商： | NXP Semiconductors N.V. |
| 英文描述： | Level translating I2C-bus/SMBus repeater |
| 中文描述： | 級別翻譯I2C-bus/SMBus中繼器 |
| 文件頁數(shù)： | 13/16頁 |
| 文件大?。?/td> | 92K |
| 代理商： | PCA9509 |
PCA9509_1
Koninklijke Philips Electronics N.V. 2006. All rights reserved.
Product data sheet
Rev. 01 — 27 June 2006
13 of 16
Philips Semiconductors
PCA9509
Level translating I
2
C-bus/SMBus repeater
–
larger than or equal to 1.27 mm, the footprint longitudinal axis is
preferred
to be
parallel to the transport direction of the printed-circuit board;
–
smaller than 1.27 mm, the footprint longitudinal axis
must
be parallel to the
transport direction of the printed-circuit board.
The footprint must incorporate solder thieves at the downstream end.
For packages with leads on four sides, the footprint must be placed at a 45
°
angle to
the transport direction of the printed-circuit board. The footprint must incorporate
solder thieves downstream and at the side corners.
During placement and before soldering, the package must be fixed with a droplet of
adhesive. The adhesive can be applied by screen printing, pin transfer or syringe
dispensing. The package can be soldered after the adhesive is cured.
Typical dwell time of the leads in the wave ranges from 3 seconds to 4 seconds at 250
°
C
or 265
°
C, depending on solder material applied, SnPb or Pb-free respectively.
A mildly-activated flux will eliminate the need for removal of corrosive residues in most
applications.
13.4 Manual soldering
Fix the component by first soldering two diagonally-opposite end leads. Use a low voltage
(24 V or less) soldering iron applied to the flat part of the lead. Contact time must be
limited to 10 seconds at up to 300
°
C.
When using a dedicated tool, all other leads can be soldered in one operation within
2 seconds to 5 seconds between 270
°
C and 320
°
C.
13.5 Package related soldering information
[1]
For more detailed information on the BGA packages refer to the (LF)BGA Application Note(AN01026);
order a copy from your Philips Semiconductors sales office.
[2]
All surface mount (SMD) packages are moisture sensitive. Depending upon the moisture content, the
maximum temperature (with respect to time) and body size of the package, there is a risk that internal or
external package cracks may occur due to vaporization of the moisture in them (the so called popcorn
effect). For details, refer to the Drypack information in the Data Handbook IC26; Integrated Circuit
Packages; Section: Packing Methods
Table 8.
Package
[1]
Suitability of surface mount IC packages for wave and reflow soldering methods
Soldering method
Wave
BGA, HTSSON..T
[3]
, LBGA, LFBGA, SQFP,
SSOP..T
[3]
, TFBGA, VFBGA, XSON
DHVQFN, HBCC, HBGA, HLQFP, HSO, HSOP,
HSQFP, HSSON, HTQFP, HTSSOP, HVQFN,
HVSON, SMS
PLCC
[5]
, SO, SOJ
LQFP, QFP, TQFP
SSOP, TSSOP, VSO, VSSOP
CWQCCN..L
[8]
, PMFP
[9]
, WQCCN..L
[8]
Reflow
[2]
suitable
not suitable
not suitable
[4]
suitable
suitable
not recommended
[5][6]
not recommended
[7]
not suitable
suitable
suitable
suitable
not suitable
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相關(guān)代理商/技術(shù)參數(shù) |
參數(shù)描述 |
|---|---|
| PCA9509A | 制造商:PHILIPS 制造商全稱:NXP Semiconductors 功能描述:Smart, simple solutions for the 12 most common design concerns |
| PCA9509ADP,118 | 功能描述:接口-信號緩沖器、中繼器 I2CbusSMBus repeater RoHS:否 制造商:Texas Instruments 工作電源電壓: 工作溫度范圍: 安裝風(fēng)格:SMD/SMT 封裝 / 箱體:VSSOP-8 封裝:Reel |
| PCA9509ADP118 | 制造商:Rochester Electronics LLC 功能描述: 制造商:NXP 功能描述: 制造商:NXP Semiconductors 功能描述: |
| PCA9509AGM,125 | 功能描述:接口-信號緩沖器、中繼器 I2CbusSMBus repeater RoHS:否 制造商:Texas Instruments 工作電源電壓: 工作溫度范圍: 安裝風(fēng)格:SMD/SMT 封裝 / 箱體:VSSOP-8 封裝:Reel |
| PCA9509D | 功能描述:接口-信號緩沖器、中繼器 I2C LV LVL TRANSLATR RoHS:否 制造商:Texas Instruments 工作電源電壓: 工作溫度范圍: 安裝風(fēng)格:SMD/SMT 封裝 / 箱體:VSSOP-8 封裝:Reel |
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