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參數(shù)資料
| 型號： | PCA9509 |
| 廠商： | NXP Semiconductors N.V. |
| 英文描述： | Level translating I2C-bus/SMBus repeater |
| 中文描述： | 級別翻譯I2C-bus/SMBus中繼器 |
| 文件頁數(shù)： | 12/16頁 |
| 文件大?。?/td> | 92K |
| 代理商： | PCA9509 |
PCA9509_1
Koninklijke Philips Electronics N.V. 2006. All rights reserved.
Product data sheet
Rev. 01 — 27 June 2006
12 of 16
Philips Semiconductors
PCA9509
Level translating I
2
C-bus/SMBus repeater
13. Soldering
13.1 Introduction to soldering surface mount packages
There is no soldering method that is ideal for all surface mount IC packages. Wave
soldering can still be used for certain surface mount ICs, but it is not suitable for fine pitch
SMDs. In these situations reflow soldering is recommended.
13.2 Reflow soldering
Reflow soldering requires solder paste (a suspension of fine solder particles, flux and
binding agent) to be applied to the printed-circuit board by screen printing, stencilling or
pressure-syringe dispensing before package placement. Driven by legislation and
environmental forces the worldwide use of lead-free solder pastes is increasing.
Several methods exist for reflowing; for example, convection or convection/infrared
heating in a conveyor type oven. Throughput times (preheating, soldering and cooling)
vary between 100 seconds and 200 seconds depending on heating method.
Typical reflow temperatures range from 215
°
C to 260
°
C depending on solder paste
material. The peak top-surface temperature of the packages should be kept below:
Moisture sensitivity precautions, as indicated on packing, must be respected at all times.
13.3 Wave soldering
Conventional single wave soldering is not recommended for surface mount devices
(SMDs) or printed-circuit boards with a high component density, as solder bridging and
non-wetting can present major problems.
To overcome these problems the double-wave soldering method was specifically
developed.
If wave soldering is used the following conditions must be observed for optimal results:
Use a double-wave soldering method comprising a turbulent wave with high upward
pressure followed by a smooth laminar wave.
For packages with leads on two sides and a pitch (e):
Table 6.
SnPb eutectic process - package peak reflow temperatures (from J-STD-020C
July 2004)
Package thickness
Volume mm
3
< 350
< 2.5 mm
240
°
C + 0/
5
°
C
≥
2.5 mm
225
°
C + 0/
5
°
C
Volume mm
3
≥
350
225
°
C + 0/
5
°
C
225
°
C + 0/
5
°
C
Table 7.
Pb-free process - package peak reflow temperatures (from J-STD-020CJuly
2004)
Package thickness
Volume mm
3
< 350
Volume mm
3
350 to
2000
260
°
C + 0
°
C
250
°
C + 0
°
C
245
°
C + 0
°
C
Volume mm
3
> 2000
< 1.6 mm
1.6 mm to 2.5 mm
≥
2.5 mm
260
°
C + 0
°
C
260
°
C + 0
°
C
250
°
C + 0
°
C
260
°
C + 0
°
C
245
°
C + 0
°
C
245
°
C + 0
°
C
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相關(guān)代理商/技術(shù)參數(shù) |
參數(shù)描述 |
|---|---|
| PCA9509A | 制造商:PHILIPS 制造商全稱:NXP Semiconductors 功能描述:Smart, simple solutions for the 12 most common design concerns |
| PCA9509ADP,118 | 功能描述:接口-信號緩沖器、中繼器 I2CbusSMBus repeater RoHS:否 制造商:Texas Instruments 工作電源電壓: 工作溫度范圍: 安裝風(fēng)格:SMD/SMT 封裝 / 箱體:VSSOP-8 封裝:Reel |
| PCA9509ADP118 | 制造商:Rochester Electronics LLC 功能描述: 制造商:NXP 功能描述: 制造商:NXP Semiconductors 功能描述: |
| PCA9509AGM,125 | 功能描述:接口-信號緩沖器、中繼器 I2CbusSMBus repeater RoHS:否 制造商:Texas Instruments 工作電源電壓: 工作溫度范圍: 安裝風(fēng)格:SMD/SMT 封裝 / 箱體:VSSOP-8 封裝:Reel |
| PCA9509D | 功能描述:接口-信號緩沖器、中繼器 I2C LV LVL TRANSLATR RoHS:否 制造商:Texas Instruments 工作電源電壓: 工作溫度范圍: 安裝風(fēng)格:SMD/SMT 封裝 / 箱體:VSSOP-8 封裝:Reel |
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