參數(shù)資料
型號: PC745BVZFU400LD
英文描述: MICROPROCESSOR|32-BIT|CMOS|BGA|255PIN|PLASTIC
中文描述: 微處理器| 32位|的CMOS | BGA封裝| 255PIN |塑料
文件頁數(shù): 8/48頁
文件大?。?/td> 276K
代理商: PC745BVZFU400LD
8/48
PC755B/745B
Figure 3 (in part A) shows the pinout of the PC755B, 360 PBGA packages as viewed from the top surface. Part B shows the side
profile of the PBGA package to indicate the direction of the top surface view.
Part A
A
B
C
D
E
F
G
H
J
K
L
M
N
P
R
T
U
V
W
1 2
3
4
5
6
7 8
9
10 11 12 13 14 15 16
Not to Scale
17 18 19
View
Die
Substrate Assembly
Encapsulant
Part B
Figure 3 : Pinout of the PC755B, 360 PBGA Packages as Viewed from the Top Surface
相關PDF資料
PDF描述
PC755BMZFU300LD MICROPROCESSOR|32-BIT|CMOS|BGA|360PIN|PLASTIC
PC755BMZFU350LD MICROPROCESSOR|32-BIT|CMOS|BGA|360PIN|PLASTIC
PC755BMZFU400LD MICROPROCESSOR|32-BIT|CMOS|BGA|360PIN|PLASTIC
PC755BVZFU300LD MICROPROCESSOR|32-BIT|CMOS|BGA|360PIN|PLASTIC
PC755 PowerPC 755/745 RISC Microprocessor
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