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參數(shù)資料
| 型號： | PC33887VW |
| 廠商： | FREESCALE SEMICONDUCTOR INC |
| 元件分類： | 運動控制電子 |
| 英文描述： | STEPPER MOTOR CONTROLLER, PDSO20 |
| 封裝： | LEAD FREE, PLASTIC, HSOP-20 |
| 文件頁數(shù)： | 21/32頁 |
| 文件大?。?/td> | 859K |
| 代理商： | PC33887VW |
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Analog Integrated Circuit Device Data
28
Freescale Semiconductor
33887
ADDITIONAL DOCUMENTATION
THERMAL ADDENDUM (REV 2.0)
ADDITIONAL DOCUMENTATION
THERMAL ADDENDUM (REV 2.0)
Introduction
This thermal addendum is provided as a supplement to the MC33887 technical
data sheet. The addendum provides thermal performance information that may
be critical in the design and development of system applications. All electrical,
application, and packaging information is provided in the data sheet.
Packaging and Thermal Considerations
The MC33887 is offered in a 20 terminal HSOP exposed pad, single die
package. There is a single heat source (P), a single junction temperature (TJ),
and thermal resistance (RθJA).
The stated values are solely for a thermal performance comparison of one
package to another in a standardized environment. This methodology is not
meant to and will not predict the performance of a package in an application-
specific environment. Stated values were obtained by measurement and
simulation according to the standards listed below.
Standards
NOTES:
1.Per JEDEC JESD51-2 at natural convection, still air condition.
2.2s2p thermal test board per JEDEC JESD51-5 and JESD51-7.
3.Per JEDEC JESD51-8, with the board temperature on the
center trace near the center lead.
4.Single layer thermal test board per JEDEC JESD51-3 and
JESD51-5.
5.Thermal resistance between the die junction and the exposed
pad surface; cold plate attached to the package bottom side,
remaining surfaces insulated
Figure 25. Thermal Land Pattern for Direct Thermal
Attachment According to JESD51-5
20-TERMINAL
HSOP-EP
33887
Note For package dimensions, refer to
the 33887 device data sheet.
DH SUFFIX
98ASH70273A
20-TERMINAL HSOP-EP
TJ
=
RθJA . P
Table 7. Thermal Performance Comparison
Thermal Resistance
[
°C/W]
RθJA
20
RθJB
6.0
RθJA
52
RθJC
1.0
0.2
Soldermast
openings
Thermal vias
connected to top
buried plane
* All measurements
are in millimeters
20 Terminal HSOP-EP
1.27 mm Pitch
16.0 mm x 11.0 mm Body
12.2 mm x 6.9 mm Exposed Pad
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