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參數(shù)資料
| 型號： | PBL38773/1ML |
| 廠商： | INFINEON TECHNOLOGIES AG |
| 元件分類： | 模擬傳輸電路 |
| 英文描述： | TELECOM-SLIC, PQCC32 |
| 封裝： | PLASTIC, VQFN-32 |
| 文件頁數(shù)： | 49/64頁 |
| 文件大?。?/td> | 1052K |
| 代理商： | PBL38773/1ML |
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Ringing FlexiSLIC
PBL 38773/1
Power Dissipation Considerations
Data Sheet
53
DS1, 2003-06-18
9
Power Dissipation Considerations
9.1
Thermal Design Considerations
The thermal resistance,
Θ
Ja, of the SLIC in a 28-pin SOIC package is 41.6 ° C/W and the
thermal resistance of 32-pin MLP package is 27
° C/W. The junction to ambient thermal
resistance value,
Θ
Ja, is extracted using the JEDEC standards and is representative of
the natural airflow as seen in an application with a multilayer board. In this device the
thermal resistance is lowered by using batwing pins, i.e. pins that are thermally and
electrically shorted to the die. This also means that the potential of the batwing pins are
the same as the substrate potential, i.e. the
V
BAT potential. To reduce the thermal
resistance in critical applications these batwing pins must be used. Typical demanding
applications involves high ring voltages, high DC-offset, high REN numbers, high line
currents together with high talk battery and used in high ambient temperatures. In these
types of applications the batwing pins shall be soldered to a large metal layer using
thermal conducting vias, i.e. small vias that will be filled with solder during the soldering
process. The metal layer shall be of the order of 1sq inch and most effective is to use an
outer layer, which can be cooled by convection. The PBL 38773/1 has a thermal
shutdown protection at a typical temperature,
T
JG of 155 ° C, see Chapter 12.1.
There are three situations where high power dissipation occurs, see following chapters
Ringing power dissipation on-hook, Chapter 9.1.1
Ringing power dissipation off-hook, Chapter 9.1.2
Off-hook power dissipation, Chapter 9.1.3
9.1.1
Ringing Power Dissipation On-Hook
The power dissipation can be calculated by the following formula:
[33]
where:
Ringing, at two-wire, is normally applied with a defined ring cadence with burst and silent
intervals where the SLIC is switched between the ring and active. Typically the time
t
A is
P
RNG
Average power during ringing
P
R
Power dissipation in Ringing
P
A
Power dissipation in Active P2 in the specification typical 65 mW
t
R
Time in Ringing
t
A
Time in Active
P
RNG
P
R
t
R
t
R
t
A
+
----------------
×
P
A
t
A
t
R
t
A
+
----------------
×
+
=
相關(guān)PDF資料 |
PDF描述 |
|---|---|
| PBL38773/1SO | TELECOM-SLIC, PDSO28 |
| PC-PVC-271K | 1 ELEMENT, 270 uH, GENERAL PURPOSE INDUCTOR |
| PC-PVC-270K | 1 ELEMENT, 27 uH, GENERAL PURPOSE INDUCTOR |
| PC-PVC-331K | 1 ELEMENT, 330 uH, GENERAL PURPOSE INDUCTOR |
| PC-PVC-392K | 1 ELEMENT, 3900 uH, GENERAL PURPOSE INDUCTOR |
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