參數(shù)資料
型號(hào): NTMD3P03R2
廠商: ON SEMICONDUCTOR
元件分類(lèi): 小信號(hào)晶體管
英文描述: Power MOSFET -3.05 Amps, -30 Volts Dual P–Channel SO–8(-3.05 A, -30 V,雙P通道,SO-8封裝的功率MOSFET)
中文描述: 2340 mA, 30 V, 2 CHANNEL, P-CHANNEL, Si, SMALL SIGNAL, MOSFET
封裝: CASE 751-07, SOIC-8 NB, 8 PIN
文件頁(yè)數(shù): 1/12頁(yè)
文件大?。?/td> 79K
代理商: NTMD3P03R2
Semiconductor Components Industries, LLC, 2001
January, 2001 – Rev. 0
1
Publication Order Number:
NTMD3P03R2/D
NTMD3P03R2
Product Preview
Power MOSFET
-3.05 Amps, -30 Volts
Dual P–Channel SO–8
Features
High Efficiency Components in a Dual SO–8 Package
High Density Power MOSFET with Low RDS(on)
Miniature SO–8 Surface Mount Package – Saves Board Space
Diode Exhibits High Speed with Soft Recovery
IDSS Specified at Elevated Temperature
Avalanche Energy Specified
Mounting Information for the SO–8 Package is Provided
Applications
DC–DC Converters
Low Voltage Motor Control
Power Management in Portable and Battery–Powered Products, i.e.:
Computers, Printers, PCMCIA Cards, Cellular & Cordless Telephones
MOSFET MAXIMUM RATINGS
(TJ = 25
°
C unless otherwise noted)
Rating
Symbol
Value
Unit
Drain–to–Source Voltage
Gate–to–Source Voltage – Continuous
Thermal Resistance –
Junction–to–Ambient (Note 1.)
Total Power Dissipation @ TA = 25
°
C
Continuous Drain Current @ 25
°
C
Continuous Drain Current @ 70
°
C
Pulsed Drain Current (Note 4.)
Thermal Resistance –
Junction–to–Ambient (Note 2.)
Total Power Dissipation @ TA = 25
°
C
Continuous Drain Current @ 25
°
C
Continuous Drain Current @ 70
°
C
Pulsed Drain Current (Note 4.)
Thermal Resistance –
Junction–to–Ambient (Note 3.)
Total Power Dissipation @ TA = 25
°
C
Continuous Drain Current @ 25
°
C
Continuous Drain Current @ 70
°
C
Pulsed Drain Current (Note 4.)
Operating and Storage
Temperature Range
Single Pulse Drain–to–Source Avalanche
Energy – Starting TJ = 25
°
C
(VDD = –30 Vdc, VGS = –4.5 Vdc, Peak
IL = –7.5 Apk, L = 5 mH, RG = 25
)
Maximum Lead Temperature for Soldering
Purposes, 1/8
from case for 10 seconds
1. Minimum FR–4 or G–10 PCB, t = Steady State.
2. Mounted onto a 2
square FR–4 Board (1
sq. 2 oz Cu 0.06
thick single
sided), t = steady state.
3. Mounted onto a 2
square FR–4 Board (1
sq. 2 oz Cu 0.06
thick single
sided), t
10 seconds.
4. Pulse Test: Pulse Width = 300 s, Duty Cycle = 2%.
VDSS
VGS
–30
±
20
V
V
R
θ
JA
PD
ID
ID
IDM
171
0.73
–2.34
–1.87
–8.0
°
C/W
W
A
A
A
R
θ
JA
PD
ID
ID
IDM
100
1.25
–3.05
–2.44
–12
°
C/W
W
A
A
A
R
θ
JA
PD
ID
ID
IDM
TJ, Tstg
62.5
2.0
–3.86
–3.1
–15
–55 to
+150
140
°
C/W
W
A
A
A
°
C
EAS
mJ
TL
260
°
C
Device
Package
Shipping
ORDERING INFORMATION
NTMD3P03R2
SO–8
2500/Tape & Reel
http://onsemi.com
P–Channel
D
S
G
2
Source–1
Gate–1
Source–2
Gate–2
3
4
1
7
6
5
8
Drain–1
Drain–1
Drain–2
Drain–2
Top View
PIN ASSIGNMENT
–3.05 AMPERES
–30 VOLTS
0.085 @ VGS = –10 V
This document contains information on a product under
development. ON Semiconductor reserves the right to
change or discontinue this product without notice.
SO–8
CASE 751
STYLE 11
1
8
ED3P03
LYWW
ED3P03 = Device Code
L
= Assembly Location
Y
= Year
WW
= Work Week
MARKING
DIAGRAM
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