參數(shù)資料
型號(hào): MT55L256L32FT-12
元件分類: SRAM
英文描述: 256K X 32 ZBT SRAM, 9 ns, PQFP100
封裝: PLASTIC, TQFP-100
文件頁(yè)數(shù): 1/25頁(yè)
文件大?。?/td> 300K
代理商: MT55L256L32FT-12
1
8Mb: 512K x 18, 256K x 32/36 Flow-Through ZBT SRAM
Micron Technology, Inc., reserves the right to change products or specifications without notice.
MT55L512L18F_C.p65 – Rev. 2/02
2002, Micron Technology, Inc.
8Mb: 512K x 18, 256K x 32/36
FLOW-THROUGH ZBT SRAM
8Mb
ZBT SRAM
FEATURES
High frequency and 100 percent bus utilization
Fast cycle times: 10ns, 11ns and 12ns
Single +3.3V ±5% power supply (VDD)
Separate +3.3V or +2.5V isolated output buffer
supply (VDDQ)
Advanced control logic for minimum control
signal interface
Individual BYTE WRITE controls may be tied LOW
Single R/W# (read/write) control pin
CKE# pin to enable clock and suspend operations
Three chip enables for simple depth expansion
Clock-controlled and registered addresses, data
I/Os and control signals
Internally self-timed, fully coherent WRITE
Internally self-timed, registered outputs to
eliminate the need to control OE#
SNOOZE MODE for reduced-power standby
Common data inputs and data outputs
Linear or Interleaved Burst Modes
Burst feature (optional)
Pin/function compatibility with 2Mb, 4Mb, and
18Mb ZBT SRAM
100-pin TQFP
165-pin FBGA
Automatic power-down
OPTIONS
MARKING
Timing (Access/Cycle/MHz)
7.5ns/10ns/100 MHz
-10
8.5ns/11ns/90 MHz
-11
9ns/12ns/83 MHz
-12
Configurations
3.3V I/O
512K x 18
MT55L512L18F
256K x 32
MT55L256L32F
256K x 36
MT55L256L36F
2.5V I/O
512K x 18
MT55L512V18F
256K x 32
MT55L256V32F
256K x 36
MT55L256V36F
Package
100-pin TQFP
T
165-pin FBGA
F*
Operating Temperature Range
Commercial (0C to +70C)
None
Industrial (-40°C to +85°C)**
IT
Part Number Example:
MT55L256L32FT-11
MT55L512L18F, MT55L512V18F,
MT55L256L32F, MT55L256V32F,
MT55L256L36F, MT55L256V36F
3.3V VDD, 3.3V or 2.5V I/O
NOTE: 1. JEDEC-standard MS-026 BHA (LQFP).
100-Pin TQFP1
* A Part Marking Guide for the FBGA devices can be found on Micron’s
** Industrial temperature range offered in specific speed grades and
configurations. Contact factory for more information.
165-Pin FBGA
GENERAL DESCRIPTION
The Micron Zero Bus Turnaround (ZBT) SRAM
family employs high-speed, low-power CMOS designs
using an advanced CMOS process.
Micron’s 8Mb ZBT SRAMs integrate a 512K x 18,
256K x 32, or 256K x 36 SRAM core with advanced
synchronous peripheral circuitry and a 2-bit burst
counter. These SRAMs are optimized for 100 percent
bus utilization, eliminating any turnaround cycles for
READ to WRITE, or WRITE to READ, transitions. All
synchronous inputs pass through registers controlled
by a positive-edge-triggered single clock input (CLK).
The synchronous inputs include all addresses, all data
for easy depth expansion (CE2, CE2#), cycle start input
相關(guān)PDF資料
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