
16 MEG x 18, 32 MEG x 9
2.5V V
EXT
, 1.8V V
DD
, HSTL, SIO, RLDRAM II
pdf: 09005aef80a41b59/zip: 09005aef811ba111
MT49H8M18C_2.fm - Rev. F 11/04 EN
Micron Technology, Inc., reserves the right to change products or specifications without notice.
2004 Micron Technology, Inc. All rights reserved.
5
General Description
The Micron
288Mb reduced latency DRAM
(RLDRAM) II is a high-speed memory device designed
for high bandwidth communication data storage.
Applications include, but are not limited to, transmit-
ting or receiving buffers in telecommunication sys-
tems and data or instruction cache applications
requiring large amounts of memory. The chip's eight-
bank architecture is optimized for high speed and
achieves a peak bandwidth of 28.8 Gb/s, using two
separate 18-bit double data rate (DDR) parts and a
maximum system clock of 400 MHz.
The DDR separate I/O interface transfers two 18- or
9-bit wide data word per clock cycle at the I/O balls.
The read port has dedicated data outputs to support
READ operations, while the write port has dedicated
input balls to support WRITE operations. Output data
is referenced to the free-running output data clock.
This architecture eliminates the need for high-speed
bus turnaround.
Commands, addresses, and control signals are reg-
istered at every positive edge of the differential input
clock, while input data is registered at both positive
and negative edges of the input data clock(s).
Read and write accesses to the RLDRAM are burst-
oriented. The burst length is programmable from 2, 4,
or 8 by setting the mode register.
The device is supplied with 2.5V and 1.8V for the
core and 1.5V or 1.8V for the output drivers.
Bank-scheduled refresh is supported with row
address generated internally.
A standard FBGA 144-ball package is used to enable
ultra high-speed data transfer rates and a simple
upgrade path from former products.