
MSP50C614
MIXED-SIGNAL PROCESSOR
SPSS023A – DECEMBER 1999 – REVISED FEBRUARY 2000
6
POST OFFICE BOX 655303
DALLAS, TEXAS 75265
absolute maximum ratings over operating free-air temperature range (unless otherwise noted)
PARAMETER
COMMENT
MIN
MAX UNITS
VDD
Supply voltage for device
See Note 1
–0.3
7
V
IDD
Maximum supply current (DAC unloaded)
See Note 2
35
mA
VI
Input voltage range
See Note 1
–0.3
VDD + 0.3
V
VO
Output voltage range
See Note 1
–0.3
VDD + 0.3
V
Storage temperature range
–30
125
°C
Stresses beyond those listed under “absolute maximum ratings” may cause permanent damage to the device. These are stress ratings only, and
functional operation of the device at these or any other conditions beyond those indicated under “recommended operating conditions” is not
implied. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability.
NOTES:
1. Unless otherwise noted, all voltages are measured with respect to VSS .
2. The total supply current includes the current out of all the I/O pins and DAC pins as well as the operating current of the device.
recommended operating conditions
PARAMETER
TEST CONDITIONS
MIN
MAX
UNIT
VDD
Supply voltage (with respect to VSS)
3.5
5.2
V
VDD = 3 V
2
3
VIH
High-level input voltage
VDD = 4.5 V
3
4.5
V
VDD = 5.2 V
3.5
5.2
VDD = 3 V
0
1
VIL
Low-level input voltage
VDD = 4.5 V
0
1.5
V
VDD = 5.2 V
0
1.7
IOH
High-level output current per pin of I/O port
VDD = 4.5 V, VOL = 4 V
–2
mA
IOL
Low-level output current per pin of I/O port
VDD = 4.5 V, VOH = 0.5 V
5
mA
IOH DAC High-level output DAC current
VDD = 4.5 V, VOL = 4 V
–10
mA
IOL DAC
Low-level output DAC current
VDD = 4.5 V, VOH = 0.5 V
20
mA
RDAC
Resistance between DACP and DACM
32
TA
Operating free-air temperature
Device functionality
0
70
°C
Cannot exceed 15 mA total per internal VDD pin. Port A, B share 1 internal VDD pin; Port C, D share 1 internal VDD; and port E, G share 1 internal
VDD.