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3–182
Motorola Sensor Device Data
For More Information On This Product,
Go to: www.freescale.com
PRESSURE (P1)/VACUUM (P2) SIDE IDENTIFICATION TABLE
Motorola designates the two sides of the pressure sensor
as the Pressure (P1) side and the Vacuum (P2) side. The
Pressure (P1) side is the side containing silicone gel which
isolates the die from the environment. The Motorola pressure
sensor is designed to operate with positive differential pres-
sure applied, P1 > P2.
The Pressure (P1) side may be identified by using the table
below:
Part Number
Case Type
Pressure (P1) Side Identifier
MPXV5004GC6U/T1
482A
Side with Port Attached
MPXV5004G6U/T1
482
Stainless Steel Cap
MPXV5004GC7U
482C
Side with Port Attached
MPXV5004G7U
482B
Stainless Steel Cap
MPXV5004GP
1369
Side with Port Attached
MPXV5004DP
1351
Side with Port Marking
MPXV5004GVP
1368
Stainless Steel Cap
ORDERING INFORMATION
MPXV5004G series pressure sensors are available in the basic element package or with a pressure port. Two packing
options are offered for the surface mount configuration.
Device Type / Order No.
Case No.
Packing Options
Device Marking
MPXV5004G6U
482
Rails
MPXV5004G
MPXV5004G6T1
482
Tape and Reel
MPXV5004G
MPXV5004GC6U
482A
Rails
MPXV5004G
MPXV5004GC6T1
482A
Tape and Reel
MPXV5004G
MPXV5004GC7U
482C
Rails
MPXV5004G
MPXV5004G7U
482B
Rails
MPXV5004G
MPXV5004GP
1369
Trays
MPXV5004G
MPXV5004DP
1351
Trays
MPXV5004G
MPXV5004GVP
1368
Trays
MPXV5004G
INFORMATION FOR USING THE SMALL OUTLINE PACKAGE (CASE 482)
MINIMUM RECOMMENDED FOOTPRINT FOR SURFACE MOUNTED APPLICATIONS
Surface mount board layout is a critical portion of the total
design. The footprint for the surface mount packages must
be the correct size to ensure proper solder connection inter-
face between the board and the package. With the correct
fottprint, the packages will self align when subjected to a
solder reflow process. It is always recommended to design
boards with a solder mask layer to avoid bridging and short-
ing between solder pads.
16.76
0.060 TYP 8X
1.52
0.100 TYP 8X
2.54
0.100 TYP 8X
2.54
0.300
7.62
Figure 5. SOP Footprint (Case 482)
inch
mm
SCALE 2:1
F
Freescale Semiconductor, Inc.
n
.