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3–172
Motorola Sensor Device Data
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ON–CHIP TEMPERATURE COMPENSATION, CALIBRATION AND SIGNAL CONDITIONING
The performance over temperature is achieved by inte-
grating the shear–stress strain gauge, temperature com-
pensation, calibration and signal conditioning circuitry onto a
single monolithic chip.
Figure 2 illustrates the gauge configuration in the basic chip
carrier (Case 482). A fluorosilicone gel isolates the die surface
and wire bonds from the environment, while allowing the pres-
sure signal to be transmitted to the silicon diaphragm.
The MPXV4006G series sensor operating characteristics
are based on use of dry air as pressure media. Media, other
than dry air, may have adverse effects on sensor performance
and long–term reliability. Internal reliability and qualification
test for dry air, and other media, are available from the factory.
Contact the factory for information regarding media tolerance
in your application.
Figure 3 shows the recommended decoupling circuit for in-
terfacing the output of the integrated sensor to the A/D input
of a microprocessor or microcontroller. Proper decoupling of
the power supply is recommended.
Figure 4 shows the sensor output signal relative to pres-
sure input. Typical, minimum and maximum output curves
are shown for operation over a temperature range of 10
°
C to
60
°
C using the decoupling circuit shown in Figure 3. The
output will saturate outside of the specified pressure range.
Figure 2. Cross–Sectional Diagram (Not to Scale)
Figure 3. Recommended power supply decoupling
and output filtering recommendations.
For additional output filtering, please refer to
Application Note AN1646.
Figure 4. Output versus Pressure Differential
MAX
DIFFERENTIAL PRESSURE (kPa)
5.0
4.0
3.0
2.0
0
O
4.5
3.5
2.5
1.5
TRANSFER FUNCTION:
Vout = VS*(0.1533*P) + 0.045]
±
5% VFSS
VS = 5.0 V
±
0.25 Vdc
TEMP = 10 to 60
°
C
1.0
0.5
MIN
TYPICAL
0
3
6
(See Note 5 in Operating Characteristics)
1.0 F
IPS
470 pF
OUTPUT
Vs
5 V
0.01 F
GND
Vout
FLUOROSILICONE
GEL DIE COAT
WIRE BOND
DIFFERENTIAL SENSING
ELEMENT
THERMOPLASTIC
CASE
STAINLESS
STEEL CAP
LEAD
FRAME
P1
P2
DIE BOND
DIE
F
Freescale Semiconductor, Inc.
n
.