參數(shù)資料
型號(hào): MPD800261F1-523-HN2
元件分類: 微控制器/微處理器
英文描述: 32-BIT, 150 MHz, RISC MICROCONTROLLER, PBGA304
封裝: 19 X 19 MM, LEAD FREE, PLASTIC, FBGA-304
文件頁(yè)數(shù): 26/45頁(yè)
文件大?。?/td> 369K
代理商: MPD800261F1-523-HN2
32
Preliminary Data Sheet A17989EE1V0DS00
PD800261
2.3 Thermal Characteristics
Table 2-3: Thermal Characteristics of Package
Parameter
Symbol
Airflow (m/s)
Unit
00.2
1
2
Thermal resistance junction to ambientNote 1
Θ
ja
30
27
23
21
K/W
Thermal resistance junction to top center of
the package surfaceNote 1
Ψ
jt
0.2
0.3
0.6
0.8
K/W
Thermal resistance top center of the package
surface to ambientNote 1
Ψ
ta
29.8
26.7
22.4
20.2
K/W
Thermal resistance junction to caseNote 2
Θ
jc
5.2
K/W
Maximum case temperature
Tcmax
105
°C
Notes: 1. The parameters are valid, if no heat sink is used and at least a 4-layer PCB with massive ground
and power planes.
2. The parameter is valid, if a heat sink is used.
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