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參數(shù)資料
| 型號： | MPD800261F1-523-HN2 |
| 元件分類： | 微控制器/微處理器 |
| 英文描述： | 32-BIT, 150 MHz, RISC MICROCONTROLLER, PBGA304 |
| 封裝： | 19 X 19 MM, LEAD FREE, PLASTIC, FBGA-304 |
| 文件頁數(shù)： | 25/45頁 |
| 文件大?。?/td> | 369K |
| 代理商： | MPD800261F1-523-HN2 |
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Preliminary Data Sheet A17989EE1V0DS00
PD800261
Parameter
Symbol
Test
Conditions
MIN.
TYP.
MAX.
Unit
CPU clock frequencyNote 1
PFC
150
MHz
Oscillator clock frequencyNote 2
PLL_FC
25
- 50 ppm
25
+ 50 ppm
MHz
Reference clock frequencyNote 3
REF_Clk_FC
25
- 50 ppm
25
+ 50 ppm
MHz
Reference clock stability
REF_Clk_TCS
-0.2
0.2
ns
MII transmit/receive clock
frequencyNote 4
PHY_Tx/
Rx_M_FC
2.5
25
MHz
Supply currentNote 5
1.5 V supply
IDD Core
10 Base-TX
mode
450
mA
3.3 V supply
IDD IO
235
mA
Supply currentNote 5
1.5 V supply
IDD Core
100 Base-
TX mode
535
mA
3.3 V supply
IDD IO
175
mA
Supply currentNote 5
1.5 V supply
IDD Core
100 Base-
FX mode
435
mA
3.3 V supply
IDD IO
85
mA
Power
consumptionNote 5
1.5 V supply
PDD Core
10 Base-TX
mode
679
mW
3.3 V supply
PDD IO
770
mW
total
PDD
1440
mW
Power
consumptionNote 5
1.5 V supply
PDD Core
100 Base-
TX mode
800
mW
3.3 V supply
PDD IO
570
mW
total
PDD
1370
mW
Power
consumptionNote 5
1.5 V supply
PDD Core
100 Base-
FX mode
650
mW
3.3 V supply
PDD IO
280
mW
total
PDD
930
mW
Notes: 1. The CPU clock is an internal signal. Different CPU core operation frequencies can be selected via
hardware settings during reset; possible settings are 50/100/150 MHz.
2. The oscillator clock is present at the CLKP_A and CLKP_B pins.
3. The reference clock is available at the REF_CLK pin, if the CONFIG1 pin was pulled low during the
active reset phase.
4. The MII transmit/receive clock needs only to be applied to the RX_CLK_P(1:0) and TX_CLK_P(1:0)
pins, if ERTEC 200 is operated in MII mode. It is not required, when the internal PHYs are used.
5. Supply currents and power consumption cannot be guaranteed as absolute maximum values. These
value are dependent on many different factors such as operating frequency, differing use of internal
function groups, use of external interfaces, package temperature, and power supply. Different appli-
cations can have very different results.
Table 2-2:
Recommended Operating Conditions (2/2)
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