參數(shù)資料
型號： MPC8555VTALD
廠商： FREESCALE SEMICONDUCTOR INC
元件分類： 微控制器/微處理器
英文描述： 32-BIT, 667 MHz, RISC PROCESSOR, PBGA783
封裝： 29 X 29 MM, 3.75 MM HEIGHT, 1 MM PITCH, LEAD FREE, FLIP CHIP, PLASTIC, BGA-783
文件頁數(shù)： 72/88頁
文件大?。?/td> 772K
代理商： MPC8555VTALD
MPC8555E PowerQUICC III Integrated Communications Processor Hardware Specification, Rev. 3.1
74
Freescale Semiconductor
Thermal
Thermagon Inc.
888-246-9050
4707 Detroit Ave.
Cleveland, OH 44102
Internet: www.thermagon.com
16.2.4
Heat Sink Selection Examples
The following section provides a heat sink selection example using one of the commercially available heat
sinks.
16.2.4.1
Case 1
For preliminary heat sink sizing, the die-junction temperature can be expressed as follows:
TJ = TI + TR + (θJC + θINT + θSA) × PD
where
TJ is the die-junction temperature
TI is the inlet cabinet ambient temperature
TR is the air temperature rise within the computer cabinet
θ
JC is the junction-to-case thermal resistance
θ
INT is the adhesive or interface material thermal resistance
θ
SA is the heat sink base-to-ambient thermal resistance
PD is the power dissipated by the device. See Table 4 and Table 5.
During operation the die-junction temperatures (TJ) should be maintained within the range specified in
Table 2. The temperature of air cooling the component greatly depends on the ambient inlet air temperature
and the air temperature rise within the electronic cabinet. An electronic cabinet inlet-air temperature (TA)
may range from 30
° to 40°C. The air temperature rise within a cabinet (TR) may be in the range of 5° to
10
°C. The thermal resistance of some thermal interface material (θ
INT) may be about 1°C/W. For the
purposes of this example, the
θJC value given in Table 49 that includes the thermal grease interface and is
documented in note 4 is used. If a thermal pad is used,
θINT must be added.
Assuming a TI of 30°C, a TR of 5°C, a FC-PBGA package θJC = 0.96, and a power consumption (PD) of
8.0 W, the following expression for TJ is obtained:
Die-junction temperature: TJ = 30°C + 5°C + (0.96°C/W + θSA) × 8.0 W
The heat sink-to-ambient thermal resistance (
θSA) versus airflow velocity for a Thermalloy heat sink
#2328B is shown in Figure 46.
Assuming an air velocity of 2 m/s, we have an effective
θSA+ of about 3.3°C/W, thus
TJ = 30°C + 5°C + (0.96°C/W + 3.3°C/W) × 8.0 W,
resulting in a die-junction temperature of approximately 69°C which is well within the maximum
operating temperature of the component.
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