參數(shù)資料
型號： MPC8555VTALD
廠商： FREESCALE SEMICONDUCTOR INC
元件分類： 微控制器/微處理器
英文描述： 32-BIT, 667 MHz, RISC PROCESSOR, PBGA783
封裝： 29 X 29 MM, 3.75 MM HEIGHT, 1 MM PITCH, LEAD FREE, FLIP CHIP, PLASTIC, BGA-783
文件頁數(shù)： 4/88頁
文件大?。?/td> 772K
代理商： MPC8555VTALD
MPC8555E PowerQUICC III Integrated Communications Processor Hardware Specification, Rev. 3.1
12
Freescale Semiconductor
Power Characteristics
3
Power Characteristics
The estimated typical power dissipation for this family of PowerQUICC III devices is shown in Table 4.
Table 3. Output Drive Capability
Driver Type
Programmable
Output Impedance
(
)
Supply
Voltage
Notes
Local bus interface utilities signals
25
OVDD = 3.3 V
1
42 (default)
PCI signals
25
2
42 (default)
DDR signal
20
GVDD = 2.5 V
TSEC/10/100 signals
42
LVDD = 2.5/3.3 V
DUART, system control, I2C, JTAG
42
OVDD = 3.3 V
Notes:
1. The drive strength of the local bus interface is determined by the configuration of the appropriate bits in PORIMPSCR.
2. The drive strength of the PCI interface is determined by the setting of the PCI_GNT1 signal at reset.
Table 4. Power Dissipation 1 2
1
The values do not include I/O supply power (OVDD, LVDD, GVDD) or AVDD.
2
Junction temperature is a function of die size, on-chip power dissipation, package thermal
resistance, mounting site (board) temperature, ambient temperature, air flow, power
dissipation of other components on the board, and board thermal resistance. Any customer
design must take these considerations into account to ensure the maximum 105 degrees
junction temperature is not exceeded on this device.
CCB Frequency
(MHz)
Core Frequency
(MHz)
VDD
Typical Power 3 4
(W)
3
Typical power is based on a nominal voltage of VDD = 1.2V, a nominal process, a junction
temperature of Tj = 105° C, and a Dhrystone 2.1 benchmark application.
4
Thermal solutions will likely need to design to a value higher than Typical Power based on the
end application, TA target, and I/O power
Maximum Power 5
(W)
5
Maximum power is based on a nominal voltage of VDD = 1.2V, worst case process, a junction
temperature of Tj = 105° C, and an artificial smoke test.
200
400
1.2
4.9
6.6
500
1.2
5.2
7.0
600
1.2
5.5
7.3
267
533
1.2
5.4
7.2
667
1.2
5.9
7.7
800
1.2
6.3
9.1
333
667
1.2
6.0
7.9
833
1.2
6.5
9.3
1000 6
6
The nominal recommended VDD = 1.3V for this speed grade.
1.3
9.6
12.8
相關(guān)PDF資料
PDF描述
MPC8555CVTALF 32-BIT, 667 MHz, RISC PROCESSOR, PBGA783
MPC8555EVTALD 32-BIT, 667 MHz, RISC PROCESSOR, PBGA783
MPC8555ECPXAJF RISC PROCESSOR, PBGA783
MPC8555EPXAJD 32-BIT, 533 MHz, RISC PROCESSOR, PBGA783
MPC8555EVTAJD 32-BIT, 533 MHz, RISC PROCESSOR, PBGA783
相關(guān)代理商/技術(shù)參數(shù)
參數(shù)描述
MPC8555VTALF 功能描述:微處理器 - MPU PQ 37 LITE 8555 RoHS:否 制造商:Atmel 處理器系列:SAMA5D31 核心:ARM Cortex A5 數(shù)據(jù)總線寬度:32 bit 最大時鐘頻率:536 MHz 程序存儲器大小:32 KB 數(shù)據(jù) RAM 大小:128 KB 接口類型:CAN, Ethernet, LIN, SPI,TWI, UART, USB 工作電源電壓:1.8 V to 3.3 V 最大工作溫度:+ 85 C 安裝風(fēng)格:SMD/SMT 封裝 / 箱體:FBGA-324
MPC8555VTAPF 功能描述:微處理器 - MPU PQ 37 LITE 8555 RoHS:否 制造商:Atmel 處理器系列:SAMA5D31 核心:ARM Cortex A5 數(shù)據(jù)總線寬度:32 bit 最大時鐘頻率:536 MHz 程序存儲器大小:32 KB 數(shù)據(jù) RAM 大小:128 KB 接口類型:CAN, Ethernet, LIN, SPI,TWI, UART, USB 工作電源電壓:1.8 V to 3.3 V 最大工作溫度:+ 85 C 安裝風(fēng)格:SMD/SMT 封裝 / 箱體:FBGA-324
MPC8555VTAQF 功能描述:IC MPU POWERQUICC III 783-FCPBGA RoHS:是 類別:集成電路 (IC) >> 嵌入式 - 微處理器 系列:MPC85xx 標(biāo)準(zhǔn)包裝:1 系列:MPC85xx 處理器類型:32-位 MPC85xx PowerQUICC III 特點:- 速度:1.2GHz 電壓:1.1V 安裝類型:表面貼裝 封裝/外殼:783-BBGA，F(xiàn)CBGA 供應(yīng)商設(shè)備封裝:783-FCPBGA（29x29） 包裝:托盤
MPC855TCVR50D4 功能描述:微處理器 - MPU POWER QUICC-NO LEAD RoHS:否 制造商:Atmel 處理器系列:SAMA5D31 核心:ARM Cortex A5 數(shù)據(jù)總線寬度:32 bit 最大時鐘頻率:536 MHz 程序存儲器大小:32 KB 數(shù)據(jù) RAM 大小:128 KB 接口類型:CAN, Ethernet, LIN, SPI,TWI, UART, USB 工作電源電壓:1.8 V to 3.3 V 最大工作溫度:+ 85 C 安裝風(fēng)格:SMD/SMT 封裝 / 箱體:FBGA-324
MPC855TCVR50D4R2 功能描述:微處理器 - MPU POWER QUICC RoHS:否 制造商:Atmel 處理器系列:SAMA5D31 核心:ARM Cortex A5 數(shù)據(jù)總線寬度:32 bit 最大時鐘頻率:536 MHz 程序存儲器大小:32 KB 數(shù)據(jù) RAM 大小:128 KB 接口類型:CAN, Ethernet, LIN, SPI,TWI, UART, USB 工作電源電壓:1.8 V to 3.3 V 最大工作溫度:+ 85 C 安裝風(fēng)格:SMD/SMT 封裝 / 箱體:FBGA-324
發(fā)布緊急采購，3分鐘左右您將得到回復(fù)。

采購需求

(若只采購一條型號，填寫一行即可)

發(fā)布成功！您可以繼續(xù)發(fā)布采購。也可以進(jìn)入我的后臺，查看報價

發(fā)布成功！您可以繼續(xù)發(fā)布采購。也可以進(jìn)入我的后臺，查看報價

*型號 *數(shù)量 廠商 批號 封裝
添加更多采購

我的聯(lián)系方式

*
*
*