參數(shù)資料
型號(hào): MPC8545EPXANGB
廠商: Freescale Semiconductor
文件頁數(shù): 63/151頁
文件大?。?/td> 0K
描述: MPU POWERQUICC III 783-PBGA
標(biāo)準(zhǔn)包裝: 1
系列: MPC85xx
處理器類型: 32-位 MPC85xx PowerQUICC III
速度: 800MHz
電壓: 1.1V
安裝類型: 表面貼裝
封裝/外殼: 783-BBGA,F(xiàn)CBGA
供應(yīng)商設(shè)備封裝: 783-FCPBGA(29x29)
包裝: 托盤
MPC8548E PowerQUICC III Integrated Processor Hardware Specifications, Rev. 9
Freescale Semiconductor
19
RESET Initialization
5
RESET Initialization
This section describes the AC electrical specifications for the RESET initialization timing requirements of
the device. The following table provides the RESET initialization AC timing specifications for the DDR
SDRAM component(s).
The following table provides the PLL lock times.
5.1
Power-On Ramp Rate
This section describes the AC electrical specifications for the power-on ramp rate requirements.
Controlling the maximum power-on ramp rate is required to avoid falsely triggering the ESD circuitry. The
following table provides the power supply ramp rate specifications.
Table 8. RESET Initialization Timing Specifications
Parameter/Condition
Min
Max
Unit
Notes
Required assertion time of HRESET
100
s—
Minimum assertion time for SRESET
3
SYSCLKs
1
PLL input setup time with stable SYSCLK before HRESET negation
100
s—
Input setup time for POR configs (other than PLL config) with respect to
negation of HRESET
4
SYSCLKs
1
Input hold time for all POR configs (including PLL config) with respect to
negation of HRESET
2
SYSCLKs
1
Maximum valid-to-high impedance time for actively driven POR configs with
respect to negation of HRESET
5
SYSCLKs
1
Note:
1. SYSCLK is the primary clock input for the device.
Table 9. PLL Lock Times
Parameter/Condition
Min
Max
Unit
Core and platform PLL lock times
100
s
Local bus PLL lock time
50
s
PCI/PCI-X bus PLL lock time
50
s
Table 10. Power Supply Ramp Rate
Parameter
Min
Max
Unit
Notes
Required ramp rate for MVREF
3500
V/s
1
Required ramp rate for VDD
4000
V/s
1, 2
Note:
1. Maximum ramp rate from 200 to 500 mV is most critical as this range may falsely trigger the ESD circuitry.
2. VDD itself is not vulnerable to false ESD triggering; however, as per Section 22.2, “PLL Power Supply Filtering,the
recommended AVDD_CORE, AVDD_PLAT, AVDD_LBIU, AVDD_PCI1 and AVDD_PCI2 filters are all connected to VDD.
Their ramp rates must be equal to or less than the VDD ramp rate.
相關(guān)PDF資料
PDF描述
IDT71T75602S166BGGI8 IC SRAM 18MBIT 166MHZ 119BGA
MPC8264AVVPIBB IC MPU POWERQUICC II 480-TBGA
IDT70V525ML55BZI8 IC SRAM 128KBIT 55NS 144FBGA
MPC8264AZUPIBB IC MPU POWERQUICC II 480-TBGA
IDT70P525ML55BZI8 IC SRAM 128KBIT 55NS 144FBGA
相關(guān)代理商/技術(shù)參數(shù)
參數(shù)描述
MPC8545EPXANGD 功能描述:微處理器 - MPU PQ38 PB ST WE 800 R3.0 RoHS:否 制造商:Atmel 處理器系列:SAMA5D31 核心:ARM Cortex A5 數(shù)據(jù)總線寬度:32 bit 最大時(shí)鐘頻率:536 MHz 程序存儲(chǔ)器大小:32 KB 數(shù)據(jù) RAM 大小:128 KB 接口類型:CAN, Ethernet, LIN, SPI,TWI, UART, USB 工作電源電壓:1.8 V to 3.3 V 最大工作溫度:+ 85 C 安裝風(fēng)格:SMD/SMT 封裝 / 箱體:FBGA-324
MPC8545EPXAQGA 功能描述:微處理器 - MPU PQ3 8545E Imaging Processor RoHS:否 制造商:Atmel 處理器系列:SAMA5D31 核心:ARM Cortex A5 數(shù)據(jù)總線寬度:32 bit 最大時(shí)鐘頻率:536 MHz 程序存儲(chǔ)器大小:32 KB 數(shù)據(jù) RAM 大小:128 KB 接口類型:CAN, Ethernet, LIN, SPI,TWI, UART, USB 工作電源電壓:1.8 V to 3.3 V 最大工作溫度:+ 85 C 安裝風(fēng)格:SMD/SMT 封裝 / 箱體:FBGA-324
MPC8545EPXAQGB 功能描述:微處理器 - MPU FG PQ38 8548 RoHS:否 制造商:Atmel 處理器系列:SAMA5D31 核心:ARM Cortex A5 數(shù)據(jù)總線寬度:32 bit 最大時(shí)鐘頻率:536 MHz 程序存儲(chǔ)器大小:32 KB 數(shù)據(jù) RAM 大小:128 KB 接口類型:CAN, Ethernet, LIN, SPI,TWI, UART, USB 工作電源電壓:1.8 V to 3.3 V 最大工作溫度:+ 85 C 安裝風(fēng)格:SMD/SMT 封裝 / 箱體:FBGA-324
MPC8545EPXATGA 功能描述:微處理器 - MPU PQ3 8545E Imaging Processor RoHS:否 制造商:Atmel 處理器系列:SAMA5D31 核心:ARM Cortex A5 數(shù)據(jù)總線寬度:32 bit 最大時(shí)鐘頻率:536 MHz 程序存儲(chǔ)器大小:32 KB 數(shù)據(jù) RAM 大小:128 KB 接口類型:CAN, Ethernet, LIN, SPI,TWI, UART, USB 工作電源電壓:1.8 V to 3.3 V 最大工作溫度:+ 85 C 安裝風(fēng)格:SMD/SMT 封裝 / 箱體:FBGA-324
MPC8545EPXATGB 功能描述:微處理器 - MPU FG PQ38 8548 RoHS:否 制造商:Atmel 處理器系列:SAMA5D31 核心:ARM Cortex A5 數(shù)據(jù)總線寬度:32 bit 最大時(shí)鐘頻率:536 MHz 程序存儲(chǔ)器大小:32 KB 數(shù)據(jù) RAM 大小:128 KB 接口類型:CAN, Ethernet, LIN, SPI,TWI, UART, USB 工作電源電壓:1.8 V to 3.3 V 最大工作溫度:+ 85 C 安裝風(fēng)格:SMD/SMT 封裝 / 箱體:FBGA-324