參數(shù)資料
型號(hào)： MPC8360ECZUALFGA
廠商： FREESCALE SEMICONDUCTOR INC
元件分類： 微控制器/微處理器
英文描述： 32-BIT, 667 MHz, RISC PROCESSOR, PBGA740
封裝： 37.50 X 37.50 MM, 1.46 MM HEIGHT, 1 MM PITCH, TBGA-740
文件頁數(shù)： 94/102頁
文件大?。?/td> 606K
代理商： MPC8360ECZUALFGA
MPC8360E/MPC8358E PowerQUICC II Pro Processor Revision 2.x TBGA Silicon Hardware Specifications, Rev. 5
Freescale Semiconductor
91
Thermal Characteristics
Example 1. Sample Table Use
Example A. To configure the device with CSB clock rate of 266 MHz, core rate of 400 MHz, and QUICC Engine
clock rate 300 MHz while the input clock rate is 33 MHz. Conf No. ‘s10’ and ‘c1’ are selected from Table 76. SPMF
is 1000, CORPLL is 0000011, CEPMF is 01001, and CEPDF is 0.
Example B. To configure the device with CSBCSB clock rate of 266 MHz, core rate of 533 MHz and QUICC Engine
clock rate 400 MHz while the input clock rate is 66 MHz. Conf No. ‘s5h’ and ‘c2h’ are selected from Table 76. SPMF
is 0100, CORPLL is 0000100, CEPMF is 00110, and CEPDF is 0.
22
Thermal
This section describes the thermal specifications of the MPC8360E/58E.
22.1
Thermal Characteristics
This table provides the package thermal characteristics for the 37.5 mm × 37.5 mm 740-TBGA package.
Index
SPMF
CORE
PLL
CEPMF CEPDF
Input Clock
(MHz)
CSB Freq
(MHz)
Core Freq
(MHz)
QUICC
Engine Freq
(MHz)
400
(MHz)
533
(MHz)
667
(MHz)
A
1000
0000011
01001
0
33
266
400
300
∞∞
∞
B
0100
0000100
00110
0
66
266
533
400
∞∞
∞
Table 77. Package Thermal Characteristics for the TBGA Package
Characteristic
Symbol
Value
Unit
Notes
Junction-to-ambient natural convection on single-layer board (1s)
RθJA
15
° C/W
Junction-to-ambient natural convection on four-layer board (2s2p)
RθJA
11
° C/W
Junction-to-ambient (@1 m/s) on single-layer board (1s)
RθJMA
10
° C/W
Junction-to-ambient (@ 1 m/s) on four-layer board (2s2p)
RθJMA
8
° C/W
Junction-to-ambient (@ 2 m/s) on single-layer board (1s)
RθJMA
9
° C/W
Junction-to-ambient (@ 2 m/s) on four-layer board (2s2p)
RθJMA
7
° C/W
Junction-to-board thermal
RθJB
4.5
° C/W
Junction-to-case thermal
RθJC
1.1
° C/W
相關(guān)PDF資料
PDF描述
MPC8360VVALDGA 32-BIT, 667 MHz, RISC PROCESSOR, PBGA740
MPC8358ECZUADDGA 32-BIT, 266 MHz, RISC PROCESSOR, PBGA740
MPC8358ZUADDGA 32-BIT, 266 MHz, RISC PROCESSOR, PBGA740
MPC8360VVAJFGA 32-BIT, 533 MHz, RISC PROCESSOR, PBGA740
MPC8360ZUALFHA 32-BIT, 667 MHz, RISC PROCESSOR, PBGA740
相關(guān)代理商/技術(shù)參數(shù)
參數(shù)描述
MPC8360ECZUALFHA 制造商:FREESCALE 制造商全稱:Freescale Semiconductor, Inc 功能描述:PowerQUICC II Pro Processor Revision 2.x TBGA Silicon Hardware Specifications
MPC8360E-MDS-PBE 功能描述:開發(fā)板和工具包 - 其他處理器 SYSTEM BOARD FOR THE FRE RoHS:否 制造商:Freescale Semiconductor 產(chǎn)品:Development Systems 工具用于評(píng)估:P3041 核心:e500mc 接口類型:I2C, SPI, USB 工作電源電壓:
MPC8360E-RDK 功能描述:開發(fā)板和工具包 - 其他處理器 GP REF DESGN BRD FOR MPC RoHS:否 制造商:Freescale Semiconductor 產(chǎn)品:Development Systems 工具用于評(píng)估:P3041 核心:e500mc 接口類型:I2C, SPI, USB 工作電源電壓:
MPC8360E-RDK 制造商:Freescale Semiconductor 功能描述:MPC8360E-RDK: Industrial Development Pla
MPC8360ETVVAGDGA 制造商:FREESCALE 制造商全稱:Freescale Semiconductor, Inc 功能描述:PowerQUICC⑩ II Pro Processor Revision 2.x TBGA Silicon Hardware Specifications
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