參數(shù)資料
型號(hào)： MPC8360ECZUALFGA
廠商： FREESCALE SEMICONDUCTOR INC
元件分類： 微控制器/微處理器
英文描述： 32-BIT, 667 MHz, RISC PROCESSOR, PBGA740
封裝： 37.50 X 37.50 MM, 1.46 MM HEIGHT, 1 MM PITCH, TBGA-740
文件頁數(shù)： 30/102頁
文件大?。?/td> 606K
代理商： MPC8360ECZUALFGA
MPC8360E/MPC8358E PowerQUICC II Pro Processor Revision 2.x TBGA Silicon Hardware Specifications, Rev. 5
Freescale Semiconductor
33
GMII, MII, RMII, TBI, RGMII, and RTBI AC Timing Specifications
8.2.4.1
TBI Transmit AC Timing Specifications
This table provides the TBI transmit AC timing specifications.
This figure shows the TBI transmit AC timing diagram.
Figure 18. TBI Transmit AC Timing Diagram
Table 33. TBI Transmit AC Timing Specifications
At recommended operating conditions with LVDD/OVDD of 3.3 V ± 10%.
Parameter/Condition
Symbol1
Min
Typ
Max
Unit
Notes
GTX_CLK clock period
tTTX
—8.0
—
ns
—
GTX_CLK duty cycle
tTTXH/tTTX
40
—
60
%
—
GTX_CLK to TBI data TCG[9:0] delay
tTTKHDX
tTTKHDV
1.0
—
——
5.0
ns
GTX_CLK clock rise time, (20% to 80%)
tTTXR
——
1.0
ns
—
GTX_CLK clock fall time, (80% to 20%)
tTTXF
——
1.0
ns
—
GTX_CLK125 reference clock period
tG125
—8.0
—
ns
GTX_CLK125 reference clock duty cycle
tG125H/tG125
45
—
55
ns
—
Notes:
1. The symbols used for timing specifications follow the pattern of t(first two letters of functional block)(signal)(state )(reference)(state) for
inputs and t(first two letters of functional block)(reference)(state)(signal)(state) for outputs. For example, tTTKHDV symbolizes the TBI
transmit timing (TT) with respect to the time from tTTX (K) going high (H) until the referenced data signals (D) reach the valid
state (V) or setup time. Also, tTTKHDX symbolizes the TBI transmit timing (TT) with respect to the time from tTTX (K) going
high (H) until the referenced data signals (D) reach the invalid state (X) or hold time. Note that, in general, the clock reference
symbol representation is based on three letters representing the clock of a particular functional. For example, the subscript
of tTTX represents the TBI (T) transmit (TX) clock. For rise and fall times, the latter convention is used with the appropriate
letter: R (rise) or F (fall).
2. This symbol is used to represent the external GTX_CLK125 and does not follow the original symbol naming convention.
3. In rev. 2.0 silicon, due to errata, tTTKHDX minimum is 0.7 ns for UCC1. Refer to Errata QE_ENET19 in Chip Errata for the
MPC8360E, Rev. 1.
GTX_CLK
TXD[7:0]
tTTX
tTTXH
tTTXR
tTTXF
tTTKHDX
TX_EN
TX_ER
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相關(guān)代理商/技術(shù)參數(shù)
參數(shù)描述
MPC8360ECZUALFHA 制造商:FREESCALE 制造商全稱:Freescale Semiconductor, Inc 功能描述:PowerQUICC II Pro Processor Revision 2.x TBGA Silicon Hardware Specifications
MPC8360E-MDS-PBE 功能描述:開發(fā)板和工具包 - 其他處理器 SYSTEM BOARD FOR THE FRE RoHS:否 制造商:Freescale Semiconductor 產(chǎn)品:Development Systems 工具用于評(píng)估:P3041 核心:e500mc 接口類型:I2C, SPI, USB 工作電源電壓:
MPC8360E-RDK 功能描述:開發(fā)板和工具包 - 其他處理器 GP REF DESGN BRD FOR MPC RoHS:否 制造商:Freescale Semiconductor 產(chǎn)品:Development Systems 工具用于評(píng)估:P3041 核心:e500mc 接口類型:I2C, SPI, USB 工作電源電壓:
MPC8360E-RDK 制造商:Freescale Semiconductor 功能描述:MPC8360E-RDK: Industrial Development Pla
MPC8360ETVVAGDGA 制造商:FREESCALE 制造商全稱:Freescale Semiconductor, Inc 功能描述:PowerQUICC⑩ II Pro Processor Revision 2.x TBGA Silicon Hardware Specifications
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