參數(shù)資料
型號: MPC8360ECZUALFGA
廠商: FREESCALE SEMICONDUCTOR INC
元件分類: 微控制器/微處理器
英文描述: 32-BIT, 667 MHz, RISC PROCESSOR, PBGA740
封裝: 37.50 X 37.50 MM, 1.46 MM HEIGHT, 1 MM PITCH, TBGA-740
文件頁數(shù): 101/102頁
文件大?。?/td> 606K
代理商: MPC8360ECZUALFGA
MPC8360E/MPC8358E PowerQUICC II Pro Processor Revision 2.x TBGA Silicon Hardware Specifications, Rev. 5
98
Freescale Semiconductor
Configuration Pin Muxing
Figure 57. Driver Impedance Measurement
The value of this resistance and the strength of the driver’s current source can be found by making two measurements. First, the
output voltage is measured while driving logic 1 without an external differential termination resistor. The measured voltage is
V1 = Rsource × Isource. Second, the output voltage is measured while driving logic 1 with an external precision differential
termination resistor of value Rterm. The measured voltage is V2 = 1/(1/R1 +1/R2)) × Isource. Solving for the output impedance
gives Rsource = Rterm × (V1/V2 – 1). The drive current is then Isource =V1/Rsource.
This table summarizes the signal impedance targets. The driver impedance are targeted at minimum VDD, nominal OVDD,
105
° C.
23.6
Configuration Pin Muxing
The device provides the user with power-on configuration options that can be set through the use of external pull-up or
pull-down resistors of 4.7 k
Ωon certain output pins (see customer visible configuration pins). These pins are generally used as
output only pins in normal operation.
While HRESET is asserted however, these pins are treated as inputs. The value presented on these pins while HRESET is
asserted, is latched when HRESET deasserts, at which time the input receiver is disabled and the I/O circuit takes on its normal
function. Careful board layout with stubless connections to these pull-up/pull-down resistors coupled with the large value of the
pull-up/pull-down resistor should minimize the disruption of signal quality or speed for output pins thus configured.
Table 79. Impedance Characteristics
Impedance
Local Bus, Ethernet, DUART,
Control, Configuration, Power
Management
PCI
DDR DRAM
Symbol
Unit
RN
42 Target
25 Target
20 Target
Z0
W
RP
42 Target
25 Target
20 Target
Z0
W
Differential
NA
ZDIFF
W
Note: Nominal supply voltages. See Table 1, TJ = 105° C.
OVDD
OGND
RP
RN
Pad
Data
SW1
SW2
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