參數(shù)資料
型號: MPC8347ECVRAJD
廠商: FREESCALE SEMICONDUCTOR INC
元件分類: 微控制器/微處理器
英文描述: 32-BIT, 533 MHz, RISC PROCESSOR, PBGA620
封裝: 29 X 29 MM, 2.46 MM HEIGHT, 1 MM PITCH, LEAD FREE, PLASTIC, BGA-620
文件頁數(shù): 56/102頁
文件大?。?/td> 1094K
代理商: MPC8347ECVRAJD
MPC8347E PowerQUICC II Pro Integrated Host Processor Hardware Specifications, Rev. 11
Freescale Semiconductor
57
Package and Pin Listings
18.3
Package Parameters for the MPC8347E PBGA
The package parameters are as provided in the following list. The package type is 29 mm
× 29 mm,
620 plastic ball grid array (PBGA).
Package outline
29 mm
× 29 mm
Interconnects
620
Pitch
1.00 mm
Module height (maximum)
2.46 mm
Module height (typical)
2.23 mm
Module height (minimum)
2.00 mm
Solder balls
62 Sn/36 Pb/2 Ag (ZQ package)
95.5 Sn/0.5 Cu/4Ag (VR package)
Ball diameter (typical)
0.60 mm
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相關(guān)代理商/技術(shù)參數(shù)
參數(shù)描述
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