參數(shù)資料
型號(hào)： MPC8309CVMAHFCA
廠商： FREESCALE SEMICONDUCTOR INC
元件分類(lèi)： 微控制器/微處理器
英文描述： 32-BIT, 417 MHz, RISC PROCESSOR, PBGA489
封裝： 19 X 19 MM, 1.61 MM HEIGHT, 0.80 MM PITCH, LEAD FREE, PLASTIC, MAPBGA-489
文件頁(yè)數(shù)： 71/81頁(yè)
文件大?。?/td> 484K
代理商： MPC8309CVMAHFCA
MPC8309 PowerQUICC II Pro Integrated Communications Processor Family Hardware Specifications, Rev. 1
Freescale Semiconductor
73
Thermal
TA = ambient temperature for the package (C)
RJA = junction-to-ambient thermal resistance (C/W)
PD = power dissipation in the package (W)
The junction-to-ambient thermal resistance is an industry standard value that provides a quick and easy
estimation of thermal performance. As a general statement, the value obtained on a single layer board is
appropriate for a tightly packed printed-circuit board. The value obtained on the board with the internal
planes is usually appropriate if the board has low power dissipation and the components are well separated.
Test cases have demonstrated that errors of a factor of two (in the quantity TJ – TA) are possible.
24.1.3
Estimation of Junction Temperature with Junction-to-Board
Thermal Resistance
The thermal performance of a device cannot be adequately predicted from the junction-to-ambient thermal
resistance. The thermal performance of any component is strongly dependent on the power dissipation of
surrounding components. In addition, the ambient temperature varies widely within the application. For
many natural convection and especially closed box applications, the board temperature at the perimeter
(edge) of the package is approximately the same as the local air temperature near the device. Specifying
the local ambient conditions explicitly as the board temperature provides a more precise description of the
local ambient conditions that determine the temperature of the device.
At a known board temperature, the junction temperature is estimated using the following equation:
TJ =TB +(R
JB PD)
Eqn. 2
where:
TJ = junction temperature (C)
TB = board temperature at the package perimeter (C)
RJB = junction-to-board thermal resistance (C/W) per JESD51-8
PD = power dissipation in package (W)
When the heat loss from the package case to the air can be ignored, acceptable predictions of junction
temperature can be made. The application board should be similar to the thermal test condition: the
component is soldered to a board with internal planes.
24.1.4
Experimental Determination of Junction Temperature
To determine the junction temperature of the device in the application after prototypes are available, the
thermal characterization parameter (
JT) can be used to determine the junction temperature with a
measurement of the temperature at the top center of the package case using the following equation:
TJ =TT +(JT PD)
Eqn. 3
where:
TJ = junction temperature (C)
相關(guān)PDF資料
PDF描述
MPC8313EVRAFF 32-BIT, 333 MHz, MICROPROCESSOR, PBGA516
MPC8313EVRAGD 32-BIT, 400 MHz, MICROPROCESSOR, PBGA516
MPC8313EZQAGDB 32-BIT, 400 MHz, MICROPROCESSOR, PBGA516
MPC8313VRAFF 32-BIT, 333 MHz, MICROPROCESSOR, PBGA516
MPC8313ECZQAGD 32-BIT, 400 MHz, MICROPROCESSOR, PBGA516
相關(guān)代理商/技術(shù)參數(shù)
參數(shù)描述
MPC8309EC 制造商:FREESCALE 制造商全稱(chēng):Freescale Semiconductor, Inc 功能描述:PowerQUICC II Pro Integrated Communications Processor Family Hardware Specifications
MPC8309-KIT 功能描述:開(kāi)發(fā)板和工具包 - 其他處理器 For MPC8309 Ethernet USB I2C SPI RoHS:否 制造商:Freescale Semiconductor 產(chǎn)品:Development Systems 工具用于評(píng)估:P3041 核心:e500mc 接口類(lèi)型:I2C, SPI, USB 工作電源電壓:
MPC8309-KIT 制造商:Freescale Semiconductor 功能描述:MPC830x Processor Evaluation Kit
MPC8309-SOM 功能描述:開(kāi)發(fā)板和工具包 - 其他處理器 For MPC8309 Ethernet USB 16bit 32bit RoHS:否 制造商:Freescale Semiconductor 產(chǎn)品:Development Systems 工具用于評(píng)估:P3041 核心:e500mc 接口類(lèi)型:I2C, SPI, USB 工作電源電壓:
MPC8309VMADDC 制造商:Freescale Semiconductor 功能描述:MPC8309VMADDC - Bulk
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