參數(shù)資料
型號： MPC8245TVV350D
廠商： MOTOROLA INC
元件分類： 微控制器/微處理器
英文描述： 32-BIT, 350 MHz, RISC PROCESSOR, PBGA352
封裝： 35 X 35 MM, 1.70 MM HEIGHT, 1.27 MM PITCH, CAVITY-UP, TBGA-352
文件頁數(shù)： 48/60頁
文件大?。?/td> 674K
代理商： MPC8245TVV350D
52
MPC8245 Integrated Processor Hardware Specications
MOTOROLA
System Design Information
(silicone, graphite/oil, oroether oil), a bare joint, and a joint with thermal grease as a function of contact
pressure. As shown, the performance of these thermal interface materials improves with increasing contact
pressure. The use of thermal grease signicantly reduces the interface thermal resistance. That is, the bare
joint results in a thermal resistance approximately seven times greater than the thermal grease joint.
Heat sinks are attached to the package by means of a spring clip to holes in the printed-circuit board (see
Figure 30). Therefore, the synthetic grease offers the best thermal performance, considering the low
interface pressure. Of course, the selection of any thermal interface material depends on many factors:
thermal performance requirements, manufacturability, service temperature, dielectric properties, cost, etc.
Figure 30. Thermal Performance of Select Thermal Interface Material
The board designer can choose between several types of thermal interface. Heat sink adhesive materials
should be selected based upon high conductivity, yet adequate mechanical strength to meet equipment
shock/vibration requirements. There are several commercially-available thermal interfaces and adhesive
materials provided by the following vendors:
Chomerics, Inc.
781-935-4850
77 Dragon Ct.
Woburn, MA 01888-4014
Internet: www.chomerics.com
Dow-Corning Corporation
800-248-2481
Dow-Corning Electronic Materials
2200 W. Salzburg Rd.
Midland, MI 48686-0997
Internet: www.dow.com
0
0.5
1
1.5
2
0
1020304050607080
Silicone Sheet (0.006 in.)
Bare Joint
Floroether Oil Sheet (0.007 in.)
Graphite/Oil Sheet (0.005 in.)
Synthetic Grease
Contact Pressure (psi)
Specific
Ther
mal
Resistance
(K-in.
2
/W)
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