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參數(shù)資料
| 型號： | MPC8245LZU350X |
| 廠商： | MOTOROLA INC |
| 元件分類： | 微控制器/微處理器 |
| 英文描述： | 32-BIT, 350 MHz, RISC PROCESSOR, PBGA352 |
| 封裝： | 35 X 35 MM, 1.65 MM HEIGHT, 1.27 MM PITCH, CAVITY DOWN, TBGA-352 |
| 文件頁數(shù)： | 47/60頁 |
| 文件大小： | 620K |
| 代理商： | MPC8245LZU350X |
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MPC8245 Integrated Processor Hardware Specications
51
PRELIMINARY—SUBJECT TO CHANGE WITHOUT NOTICE
System Design Information
For this cavity-down, wire-bond TBGA package, heat generated on the active side of the chip is conducted
through the silicon, the die attach and package spreader, then through the heat sink attach material (or
thermal interface material), and nally to the heat sink where it is removed by forced-air convection.
1.7.10.2 Adhesives and Thermal Interface Materials
A thermal interface material is recommended at the package lid-to-heat sink interface to minimize the
thermal contact resistance. For those applications where the heat sink is attached by spring clip
mechanism, Figure 32 shows the thermal performance of three thin-sheet thermal-interface materials
(silicone, graphite/oil, oroether oil), a bare joint, and a joint with thermal grease as a function of contact
pressure. As shown, the performance of these thermal interface materials improves with increasing contact
pressure. The use of thermal grease signicantly reduces the interface thermal resistance. That is, the bare
joint results in a thermal resistance approximately 7 times greater than the thermal grease joint.
Heat sinks are attached to the package by means of a spring clip to holes in the printed-circuit board (see
Figure 31). Therefore, the synthetic grease offers the best thermal performance, considering the low
interface pressure. Of course, the selection of any thermal interface material depends on many
factors—thermal performance requirements, manufacturability, service temperature, dielectric properties,
cost, etc.
Figure 32. Thermal Performance of Select Thermal Interface Material
The board designer can choose between several types of thermal interface. Heat sink adhesive materials
should be selected based upon high conductivity, yet adequate mechanical strength to meet equipment
shock/vibration requirements. There are several commercially-available thermal interfaces and adhesive
materials provided by the following vendors:
0
0.5
1
1.5
2
0
1020304050607080
Silicone Sheet (0.006 inch)
Bare Joint
Floroether Oil Sheet (0.007 inch)
Graphite/Oil Sheet (0.005 inch)
Synthetic Grease
Contact Pressure (PSI)
Specific
Thermal
Resistance
(Kin
2
/W)
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