參數(shù)資料
型號(hào)： MPC8245LVV350D
廠商： MOTOROLA INC
元件分類(lèi)： 微控制器/微處理器
英文描述： 32-BIT, 350 MHz, RISC PROCESSOR, PBGA352
封裝： 35 X 35 MM, 1.27 MM PITCH, LEAD FREE, TBGA-352
文件頁(yè)數(shù)： 5/64頁(yè)
文件大?。?/td> 893K
代理商： MPC8245LVV350D
MOTOROLA
MPC8245 Integrated Processor Hardware Specifications
13
Electrical and Thermal Characteristics
1.4.2
Thermal Characteristics
Table 6 provides the package thermal characteristics for the MPC8245. For further information, see
1.4.3
AC Electrical Characteristics
This section provides the AC electrical characteristics for the MPC8245. After fabrication, functional parts
are sorted by maximum processor core frequency as shown in Table 7 and tested for conformance to the AC
specifications for that frequency. The processor core frequency is determined by the bus (PCI_SYNC_IN)
clock frequency and the settings of the PLL_CFG[0:4] signals. Parts are sold by maximum processor core
frequency. See Section 1.9, “Ordering Information,” for more details on ordering parts.
Table 6. Thermal Characteristics
Characteristic
Symbol
Value
Unit
Notes
Junction-to-ambient natural convection
(Single-layer board—1s)
RθJA
16.1
°C/W
1, 2
Junction-to-ambient natural convection
(Four-layer board—2s2p)
RθJMA
12.0
°C/W
1, 3
Junction-to-ambient (@200 ft/min)
(Single-layer board—1s)
RθJMA
11.6
°C/W
1, 3
Junction-to-ambient (@200 ft/min)
(Four layer board—2s2p)
RθJMA
9.0
°C/W
1, 3
Junction-to-board
RθJB
4.8
°C/W
4
Junction-to-case
RθJC
1.8
°C/W
5
Junction-to-package top (natural convection)
ΨJT
1.0
°C/W
6
Notes:
1. Junction temperature is a function of die size, on-chip power dissipation, package thermal resistance, mounting site
(board) temperature, ambient temperature, airflow, power dissipation of other components on the board, and board
thermal resistance.
2. Per SEMI G38-87 and JEDEC JESD51-2 with the single-layer board horizontal.
3. Per JEDEC JESD51-6 with the board horizontal.
4. Thermal resistance between the die and the printed-circuit board per JEDEC JESD51-8. Board temperature is
measured on the top surface of the board near the package.
5. Thermal resistance between the die and the case top surface as measured by the cold plate method (MIL
SPEC-883 Method 1012.1) with the cold plate used for case temperature.
6. Thermal characterization parameter indicating the temperature difference between the package top and the
junction temperature per JEDEC JESD51-2. When Greek letters are not available, the thermal characterization
parameter is written as Psi-JT.
相關(guān)PDF資料
PDF描述
MPC8245LZU266D 32-BIT, 266 MHz, RISC PROCESSOR, PBGA352
MPC8245LVV300D 32-BIT, 300 MHz, RISC PROCESSOR, PBGA352
MPC8245LVV333D 32-BIT, 333 MHz, RISC PROCESSOR, PBGA352
MPC8245TVV300D 32-BIT, 300 MHz, RISC PROCESSOR, PBGA352
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相關(guān)代理商/技術(shù)參數(shù)
參數(shù)描述
MPC8245LZU266D 功能描述:微處理器 - MPU 266MHz 505.4MIPS RoHS:否 制造商:Atmel 處理器系列:SAMA5D31 核心:ARM Cortex A5 數(shù)據(jù)總線寬度:32 bit 最大時(shí)鐘頻率:536 MHz 程序存儲(chǔ)器大小:32 KB 數(shù)據(jù) RAM 大小:128 KB 接口類(lèi)型:CAN, Ethernet, LIN, SPI,TWI, UART, USB 工作電源電壓:1.8 V to 3.3 V 最大工作溫度:+ 85 C 安裝風(fēng)格:SMD/SMT 封裝 / 箱體:FBGA-324
MPC8245LZU300D 功能描述:微處理器 - MPU 300MHz 570MIPS RoHS:否 制造商:Atmel 處理器系列:SAMA5D31 核心:ARM Cortex A5 數(shù)據(jù)總線寬度:32 bit 最大時(shí)鐘頻率:536 MHz 程序存儲(chǔ)器大小:32 KB 數(shù)據(jù) RAM 大小:128 KB 接口類(lèi)型:CAN, Ethernet, LIN, SPI,TWI, UART, USB 工作電源電壓:1.8 V to 3.3 V 最大工作溫度:+ 85 C 安裝風(fēng)格:SMD/SMT 封裝 / 箱體:FBGA-324
MPC8245LZU333D 功能描述:微處理器 - MPU 333MHz 632.7MIPS RoHS:否 制造商:Atmel 處理器系列:SAMA5D31 核心:ARM Cortex A5 數(shù)據(jù)總線寬度:32 bit 最大時(shí)鐘頻率:536 MHz 程序存儲(chǔ)器大小:32 KB 數(shù)據(jù) RAM 大小:128 KB 接口類(lèi)型:CAN, Ethernet, LIN, SPI,TWI, UART, USB 工作電源電壓:1.8 V to 3.3 V 最大工作溫度:+ 85 C 安裝風(fēng)格:SMD/SMT 封裝 / 箱體:FBGA-324
MPC8245LZU350D 功能描述:微處理器 - MPU 350MHz 665MIPS RoHS:否 制造商:Atmel 處理器系列:SAMA5D31 核心:ARM Cortex A5 數(shù)據(jù)總線寬度:32 bit 最大時(shí)鐘頻率:536 MHz 程序存儲(chǔ)器大小:32 KB 數(shù)據(jù) RAM 大小:128 KB 接口類(lèi)型:CAN, Ethernet, LIN, SPI,TWI, UART, USB 工作電源電壓:1.8 V to 3.3 V 最大工作溫度:+ 85 C 安裝風(fēng)格:SMD/SMT 封裝 / 箱體:FBGA-324
MPC8245RZU400D 制造商:FREESCALE 制造商全稱(chēng):Freescale Semiconductor, Inc 功能描述:Part Number Specification for the MPC8245ARZUnnnX Series
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