參數(shù)資料
型號(hào)： MPC8245LVV350D
廠商： MOTOROLA INC
元件分類： 微控制器/微處理器
英文描述： 32-BIT, 350 MHz, RISC PROCESSOR, PBGA352
封裝： 35 X 35 MM, 1.27 MM PITCH, LEAD FREE, TBGA-352
文件頁(yè)數(shù)： 49/64頁(yè)
文件大?。?/td> 893K
代理商： MPC8245LVV350D
MOTOROLA
MPC8245 Integrated Processor Hardware Specifications
53
System Design Information
(silicone, graphite/oil, floroether oil), a bare joint, and a joint with thermal grease as a function of contact
pressure. As shown, the performance of these thermal interface materials improves with increasing contact
pressure. The use of thermal grease significantly reduces the interface thermal resistance. That is, the bare
joint results in a thermal resistance approximately seven times greater than the thermal grease joint.
Heat sinks are attached to the package by means of a spring clip to holes in the printed-circuit board (see
Figure 32). Therefore, synthetic grease offers the best thermal performance, considering the low interface
pressure. Of course, the selection of any thermal interface material depends on many factors: thermal
performance requirements, manufacturability, service temperature, dielectric properties, cost, and so on.
Figure 32. Thermal Performance of Select Thermal Interface Material
The board designer can choose between several types of thermal interfaces. Heat sink adhesive materials
should be selected based on high conductivity and yet adequate mechanical strength to meet equipment
shock/vibration requirements. There are several commercially-available thermal interfaces and adhesive
materials provided by the following vendors:
Chomerics, Inc.
781-935-4850
77 Dragon Ct.
Woburn, MA 01888-4014
Internet: www.chomerics.com
Dow-Corning Corporation
800-248-2481
Dow-Corning Electronic Materials
2200 W. Salzburg Rd.
Midland, MI 48686-0997
Internet: www.dow.com
0
0.5
1
1.5
2
0
10
203040
50
60
7080
Silicone Sheet (0.006 in.)
Bare Joint
Floroether Oil Sheet (0.007 in.)
Graphite/Oil Sheet (0.005 in.)
Synthetic Grease
Contact Pressure (psi)
S
p
ec
if
ic
T
h
er
m
a
lR
e
s
is
tan
ce
(
K
-i
n
.2
/W)
相關(guān)PDF資料
PDF描述
MPC8245LZU266D 32-BIT, 266 MHz, RISC PROCESSOR, PBGA352
MPC8245LVV300D 32-BIT, 300 MHz, RISC PROCESSOR, PBGA352
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相關(guān)代理商/技術(shù)參數(shù)
參數(shù)描述
MPC8245LZU266D 功能描述:微處理器 - MPU 266MHz 505.4MIPS RoHS:否 制造商:Atmel 處理器系列:SAMA5D31 核心:ARM Cortex A5 數(shù)據(jù)總線寬度:32 bit 最大時(shí)鐘頻率:536 MHz 程序存儲(chǔ)器大小:32 KB 數(shù)據(jù) RAM 大小:128 KB 接口類型:CAN, Ethernet, LIN, SPI,TWI, UART, USB 工作電源電壓:1.8 V to 3.3 V 最大工作溫度:+ 85 C 安裝風(fēng)格:SMD/SMT 封裝 / 箱體:FBGA-324
MPC8245LZU300D 功能描述:微處理器 - MPU 300MHz 570MIPS RoHS:否 制造商:Atmel 處理器系列:SAMA5D31 核心:ARM Cortex A5 數(shù)據(jù)總線寬度:32 bit 最大時(shí)鐘頻率:536 MHz 程序存儲(chǔ)器大小:32 KB 數(shù)據(jù) RAM 大小:128 KB 接口類型:CAN, Ethernet, LIN, SPI,TWI, UART, USB 工作電源電壓:1.8 V to 3.3 V 最大工作溫度:+ 85 C 安裝風(fēng)格:SMD/SMT 封裝 / 箱體:FBGA-324
MPC8245LZU333D 功能描述:微處理器 - MPU 333MHz 632.7MIPS RoHS:否 制造商:Atmel 處理器系列:SAMA5D31 核心:ARM Cortex A5 數(shù)據(jù)總線寬度:32 bit 最大時(shí)鐘頻率:536 MHz 程序存儲(chǔ)器大小:32 KB 數(shù)據(jù) RAM 大小:128 KB 接口類型:CAN, Ethernet, LIN, SPI,TWI, UART, USB 工作電源電壓:1.8 V to 3.3 V 最大工作溫度:+ 85 C 安裝風(fēng)格:SMD/SMT 封裝 / 箱體:FBGA-324
MPC8245LZU350D 功能描述:微處理器 - MPU 350MHz 665MIPS RoHS:否 制造商:Atmel 處理器系列:SAMA5D31 核心:ARM Cortex A5 數(shù)據(jù)總線寬度:32 bit 最大時(shí)鐘頻率:536 MHz 程序存儲(chǔ)器大小:32 KB 數(shù)據(jù) RAM 大小:128 KB 接口類型:CAN, Ethernet, LIN, SPI,TWI, UART, USB 工作電源電壓:1.8 V to 3.3 V 最大工作溫度:+ 85 C 安裝風(fēng)格:SMD/SMT 封裝 / 箱體:FBGA-324
MPC8245RZU400D 制造商:FREESCALE 制造商全稱:Freescale Semiconductor, Inc 功能描述:Part Number Specification for the MPC8245ARZUnnnX Series
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