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參數(shù)資料
| 型號： | MPC8241LZP200X |
| 廠商： | MOTOROLA INC |
| 元件分類： | 微控制器/微處理器 |
| 英文描述： | 32-BIT, 200 MHz, RISC PROCESSOR, PBGA357 |
| 封裝： | 25 X 25 MM, PLASTIC, BGA-357 |
| 文件頁數(shù)： | 48/56頁 |
| 文件大?。?/td> | 739K |
| 代理商： | MPC8241LZP200X |
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52
MPC8241 Integrated Processor Hardware Specifications
MOTOROLA
Ordering Information
1.9
Ordering Information
Ordering information for the parts fully covered by this specification document is provided in Section 1.9.1,
“Part Numbers Fully Addressed by This Document.” Section 1.9.2, “Part Numbers Not Fully Addressed by
This Document,” lists the part numbers which do not fully conform to the specifications of this document.
These special part numbers require an additional document called a part number specification.
1.9.1
Part Numbers Fully Addressed by This Document
Table 20 provides the Motorola part numbering nomenclature for the MPC8241. Note that the individual
part numbers correspond to a maximum processor core frequency. For available frequencies, contact your
local Motorola sales office. In addition to the processor frequency, the part numbering scheme also includes
an application modifier which may specify special application conditions. Each part number also contains
a revision code which refers to the die mask revision number.
1.9.2
Part Numbers Not Fully Addressed by This Document
Parts with application modifiers or revision levels not fully addressed in this specification document are
described in separate part number specifications which supplement and supersede this document; see
Table 20. Part Numbering Nomenclature
XPC
nnnn
L
xx
nnn
x
Product
Code
Part
Identifier
Process Descriptor
Package 1
Processor
Frequency 2
Revision Level
MPC
8241
L = Standard Spec.
1.8 V ±100 mV
0
° to 105°C
ZP = PBGA
166 MHz
200 MHz
Contact local Motorola sales office
Notes:
1. See Section 1.5, “Package Description,” for more information on available package types.
2. Processor core frequencies supported by parts addressed by this specification only. Not all parts described in
this specification support all core frequencies. Additionally, parts addressed by part number specifications
may support other maximum core frequencies.
Table 21. Part Numbers with Separate Documentation
Part Number Series
Operating Conditions
Document Order Number of
Applicable Specification
XPC8241TZP
nnnx
1.8 V ±100 mV, –40
° to 105°C
166 MHz, 200 MHz
MPC8241TZPPNS/D
Note: For other differences, see applicable specifications.
相關(guān)PDF資料 |
PDF描述 |
|---|---|
| MPC8245LZU350B | 32-BIT, 350 MHz, RISC PROCESSOR, PBGA352 |
| MPC8245LZU333B | 32-BIT, 333 MHz, RISC PROCESSOR, PBGA352 |
| MPC8245LZU300B | 32-BIT, 300 MHz, RISC PROCESSOR, PBGA352 |
| MPC8245LZU266B | 32-BIT, 266 MHz, RISC PROCESSOR, PBGA352 |
| MPC8260ACZUMIBB | 32-BIT, 266 MHz, RISC PROCESSOR, PBGA480 |
相關(guān)代理商/技術(shù)參數(shù) |
參數(shù)描述 |
|---|---|
| MPC8241LZQ166D | 功能描述:微處理器 - MPU 166MHz 315.4MIPS RoHS:否 制造商:Atmel 處理器系列:SAMA5D31 核心:ARM Cortex A5 數(shù)據(jù)總線寬度:32 bit 最大時鐘頻率:536 MHz 程序存儲器大小:32 KB 數(shù)據(jù) RAM 大小:128 KB 接口類型:CAN, Ethernet, LIN, SPI,TWI, UART, USB 工作電源電壓:1.8 V to 3.3 V 最大工作溫度:+ 85 C 安裝風(fēng)格:SMD/SMT 封裝 / 箱體:FBGA-324 |
| MPC8241LZQ200D | 功能描述:微處理器 - MPU 200MHz 380MIPS RoHS:否 制造商:Atmel 處理器系列:SAMA5D31 核心:ARM Cortex A5 數(shù)據(jù)總線寬度:32 bit 最大時鐘頻率:536 MHz 程序存儲器大小:32 KB 數(shù)據(jù) RAM 大小:128 KB 接口類型:CAN, Ethernet, LIN, SPI,TWI, UART, USB 工作電源電壓:1.8 V to 3.3 V 最大工作溫度:+ 85 C 安裝風(fēng)格:SMD/SMT 封裝 / 箱體:FBGA-324 |
| MPC8241LZQ200D | 制造商:Freescale Semiconductor 功能描述:IC 32BIT MPU 200MHZ BGA-357 |
| MPC8241LZQ266D | 功能描述:微處理器 - MPU 266MHz 266MIPS RoHS:否 制造商:Atmel 處理器系列:SAMA5D31 核心:ARM Cortex A5 數(shù)據(jù)總線寬度:32 bit 最大時鐘頻率:536 MHz 程序存儲器大小:32 KB 數(shù)據(jù) RAM 大小:128 KB 接口類型:CAN, Ethernet, LIN, SPI,TWI, UART, USB 工作電源電壓:1.8 V to 3.3 V 最大工作溫度:+ 85 C 安裝風(fēng)格:SMD/SMT 封裝 / 箱體:FBGA-324 |
| MPC8241TVR166D | 功能描述:微處理器 - MPU INTEGRATED HOST PROC RoHS:否 制造商:Atmel 處理器系列:SAMA5D31 核心:ARM Cortex A5 數(shù)據(jù)總線寬度:32 bit 最大時鐘頻率:536 MHz 程序存儲器大小:32 KB 數(shù)據(jù) RAM 大小:128 KB 接口類型:CAN, Ethernet, LIN, SPI,TWI, UART, USB 工作電源電壓:1.8 V to 3.3 V 最大工作溫度:+ 85 C 安裝風(fēng)格:SMD/SMT 封裝 / 箱體:FBGA-324 |
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