參數(shù)資料
型號(hào)： MPC8241LZP200X
廠商： MOTOROLA INC
元件分類(lèi)： 微控制器/微處理器
英文描述： 32-BIT, 200 MHz, RISC PROCESSOR, PBGA357
封裝： 25 X 25 MM, PLASTIC, BGA-357
文件頁(yè)數(shù)： 4/56頁(yè)
文件大?。?/td> 739K
代理商： MPC8241LZP200X
12
MPC8241 Integrated Processor Hardware Specifications
MOTOROLA
Electrical and Thermal Characteristics
1.4.2
Thermal Characteristics
Table 6 provides the package thermal characteristics for the MPC8241. For further information, see
1.4.3
AC Electrical Characteristics
This section provides the AC electrical characteristics for the MPC8241. After fabrication, functional parts
are sorted by maximum processor core frequency as shown in Table 7 and tested for conformance to the AC
specifications for that frequency. The processor core frequency is determined by the bus (PCI_SYNC_IN)
clock frequency and the settings of the PLL_CFG[0:4] signals. Parts are sold by maximum processor core
Table 7 provides the operating frequency information for the MPC8241 at recommended operating
conditions (see Table 2) with LVDD = 3.3 V ±0.3 V.
Table 6. Thermal Characterization Data
Rating
Board Description
Symbol
Value
Unit
Notes
Junction-to-ambient natural convection
Single-layer board (1s)
RθJA
40
°C/W
1, 2
Junction-to-ambient natural convection
Four-layer board (2s2p)
RθJMA
25
°C/W
1, 3
Junction-to-ambient (@200 ft/min)
Single-layer board (1s)
RθJMA
32
°C/W
1, 3
Junction-to-ambient (@200 ft/min)
Four-layer board (2s2p)
RθJMA
21
°C/W
1, 3
Junction-to-board (bottom)
Four-layer board (2s2p)
RθJB
15
°C/W
4
Junction-to-case (top)
Single-layer board (1s)
RθJC
7°C/W
5
Junction-to-package top
Natural convection
Ψ
JT
2°C/W
6
Junction-to-package top
200 ft/min
Ψ
JT
3°C/W
6
Notes:
1. Junction temperature is a function of on-chip power dissipation, package thermal resistance, mounting site (board)
temperature, ambient temperature, airflow, power dissipation of other components on the board, and board
thermal resistance.
2. Per SEMI G38-87 and EIA/JESD51-2 with the board horizontal.
3. Per EIA/JESD51-6 with the board horizontal.
4. Thermal resistance between the die and the printed-circuit board.
5. Indicates the average thermal resistance between the die and the case top surface as measured by the cold plate
method (MIL SPEC-883 Method 1012.1) with the cold plate temperature used for the case temperature.
6. Thermal characterization parameter indicating the temperature difference between package top and the junction
temperature per EIA/JESD51-2.
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相關(guān)代理商/技術(shù)參數(shù)
參數(shù)描述
MPC8241LZQ166D 功能描述:微處理器 - MPU 166MHz 315.4MIPS RoHS:否 制造商:Atmel 處理器系列:SAMA5D31 核心:ARM Cortex A5 數(shù)據(jù)總線寬度:32 bit 最大時(shí)鐘頻率:536 MHz 程序存儲(chǔ)器大小:32 KB 數(shù)據(jù) RAM 大小:128 KB 接口類(lèi)型:CAN, Ethernet, LIN, SPI,TWI, UART, USB 工作電源電壓:1.8 V to 3.3 V 最大工作溫度:+ 85 C 安裝風(fēng)格:SMD/SMT 封裝 / 箱體:FBGA-324
MPC8241LZQ200D 功能描述:微處理器 - MPU 200MHz 380MIPS RoHS:否 制造商:Atmel 處理器系列:SAMA5D31 核心:ARM Cortex A5 數(shù)據(jù)總線寬度:32 bit 最大時(shí)鐘頻率:536 MHz 程序存儲(chǔ)器大小:32 KB 數(shù)據(jù) RAM 大小:128 KB 接口類(lèi)型:CAN, Ethernet, LIN, SPI,TWI, UART, USB 工作電源電壓:1.8 V to 3.3 V 最大工作溫度:+ 85 C 安裝風(fēng)格:SMD/SMT 封裝 / 箱體:FBGA-324
MPC8241LZQ200D 制造商:Freescale Semiconductor 功能描述:IC 32BIT MPU 200MHZ BGA-357
MPC8241LZQ266D 功能描述:微處理器 - MPU 266MHz 266MIPS RoHS:否 制造商:Atmel 處理器系列:SAMA5D31 核心:ARM Cortex A5 數(shù)據(jù)總線寬度:32 bit 最大時(shí)鐘頻率:536 MHz 程序存儲(chǔ)器大小:32 KB 數(shù)據(jù) RAM 大小:128 KB 接口類(lèi)型:CAN, Ethernet, LIN, SPI,TWI, UART, USB 工作電源電壓:1.8 V to 3.3 V 最大工作溫度:+ 85 C 安裝風(fēng)格:SMD/SMT 封裝 / 箱體:FBGA-324
MPC8241TVR166D 功能描述:微處理器 - MPU INTEGRATED HOST PROC RoHS:否 制造商:Atmel 處理器系列:SAMA5D31 核心:ARM Cortex A5 數(shù)據(jù)總線寬度:32 bit 最大時(shí)鐘頻率:536 MHz 程序存儲(chǔ)器大小:32 KB 數(shù)據(jù) RAM 大小:128 KB 接口類(lèi)型:CAN, Ethernet, LIN, SPI,TWI, UART, USB 工作電源電壓:1.8 V to 3.3 V 最大工作溫度:+ 85 C 安裝風(fēng)格:SMD/SMT 封裝 / 箱體:FBGA-324
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