參數(shù)資料
型號: MPC8241LZP200X
廠商: MOTOROLA INC
元件分類: 微控制器/微處理器
英文描述: 32-BIT, 200 MHz, RISC PROCESSOR, PBGA357
封裝: 25 X 25 MM, PLASTIC, BGA-357
文件頁數(shù): 43/56頁
文件大?。?/td> 739K
代理商: MPC8241LZP200X
48
MPC8241 Integrated Processor Hardware Specifications
MOTOROLA
System Design Information
Figure 30. Thermal Performance of Select Thermal Interface Material
The board designer can choose between several types of thermal interface. Heat sink adhesive materials
should be selected based upon high conductivity, yet adequate mechanical strength to meet equipment
shock/vibration requirements. There are several commercially-available thermal interfaces and adhesive
materials provided by the following vendors:
The Bergquist Company
800-347-4572
18930 West 78th St.
Chanhassen, MN 55317
Internet: www.bergquistcompany.com
Chomerics, Inc.
781-935-4850
77 Dragon Ct.
Woburn, MA 01888-4014
Internet: www.chomerics.com
Dow-Corning Corporation
800-248-2481
Dow-Corning Electronic Materials
2200 W. Salzburg Rd.
Midland, MI 48686-0997
Internet: www.dow.com
Shin-Etsu MicroSi, Inc.
888-642-7674
10028 S. 51st St.
Phoenix, AZ 85044
Internet: www.microsi.com
0
0.5
1
1.5
2
0
102030
40
50
607080
Silicone Sheet (0.006 in.)
Bare Joint
Floroether Oil Sheet (0.007 in.)
Graphite/Oil Sheet (0.005 in.)
Synthetic Grease
Contact Pressure (psi)
Spec
ifi
c
T
herm
a
lRes
is
tan
c
e
(K-in
.2
/W
)
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