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參數(shù)資料
| 型號： | MPC7410RX400NE |
| 廠商： | FREESCALE SEMICONDUCTOR INC |
| 元件分類： | 微控制器/微處理器 |
| 英文描述： | 32-BIT, 400 MHz, RISC PROCESSOR, CBGA360 |
| 封裝： | 25 X 25 MM, 3.20 MM HEIGHT, 1.27 MM PITCH, CERAMIC, BGA-360 |
| 文件頁數(shù)： | 37/73頁 |
| 文件大?。?/td> | 929K |
| 代理商： | MPC7410RX400NE |
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42
MPC7410 RISC Microprocessor Hardware Specications
MOTOROLA
System Design Information
The board designer can choose between several types of thermal interface. Heat sink adhesive materials
should be selected based upon high conductivity, yet adequate mechanical strength to meet equipment
shock/vibration requirements. There are several commercially-available thermal interfaces and adhesive
materials provided by the following vendors:
Chomerics, Inc.
781-935-4850
77 Dragon Court
Woburn, MA 01888-4014
Internet: www.chomerics.com
Dow-Corning Corporation
800-248-2481
Dow-Corning Electronic Materials
2200 W. Salzburg Rd.
Midland, MI 48686-0997
Internet: www.dow.com
Shin-Etsu MicroSi, Inc
888-642-7674
10028 S. 51st St.
Phoenix, AZ 85044
Internet: www.microsi.com
Thermagon Inc.
888-246-9050
4707 Detroit Ave.
Cleveland, OH 44102
Internet: www.thermagon.com
1.8.8.3
Heat Sink Selection Example
For preliminary heat sink sizing, the die-junction temperature can be expressed as follows:
Tj = Ta + Tr + (θjc + θint + θsa) × Pd
where:
Tj is the die-junction temperature
Ta is the inlet cabinet ambient temperature
Tr is the air temperature rise within the computer cabinet
θ
jc is the junction-to-case thermal resistance
θ
int is the adhesive or interface material thermal resistance
θ
sa is the heat sink base-to-ambient thermal resistance
Pd is the power dissipated by the device
During operation the die-junction temperatures (Tj) should be maintained less than the value specied in
Table 3. The temperature of the air cooling the component greatly depends upon the ambient inlet air
temperature and the air temperature rise within the electronic cabinet. An electronic cabinet inlet-air
temperature (Ta) may range from 30° to 40°C. The air temperature rise within a cabinet (Tr) may be in the
range of 5° to 10°C. The thermal resistance of the thermal interface material (
θ
int) is typically about 1°C/W.
Assuming a Ta of 30°C, a Tr of 5°C, a CBGA package θjc = 0.03, and a power consumption (Pd) of 5.0 W,
the following expression for Tj is obtained:
Die-junction temperature:
Tj = 30°C + 5°C + (0.03°C/W + 1.0°C/W + θsa) × 5.0 W
For a Thermalloy heat sink #2328B, the heat sink-to-ambient thermal resistance (
θ
sa) versus airow
velocity is shown in Figure 26.
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| MPC7410RX450NE | 制造商:FREESCALE 制造商全稱:Freescale Semiconductor, Inc 功能描述:MPC7410 RISC Microprocessor Hardware Specifications Addendum |
| MPC7410RX500LE | 功能描述:IC MPU 32BIT 500MHZ PPC 360-CBGA RoHS:否 類別:集成電路 (IC) >> 嵌入式 - 微處理器 系列:MPC74xx 標準包裝:2 系列:MPC8xx 處理器類型:32-位 MPC8xx PowerQUICC 特點:- 速度:133MHz 電壓:3.3V 安裝類型:表面貼裝 封裝/外殼:357-BBGA 供應商設備封裝:357-PBGA（25x25） 包裝:托盤 |
| MPC7410THX400LE | 功能描述:微處理器 - MPU NT HITCE RV1.4 1.8V -40C RoHS:否 制造商:Atmel 處理器系列:SAMA5D31 核心:ARM Cortex A5 數(shù)據(jù)總線寬度:32 bit 最大時鐘頻率:536 MHz 程序存儲器大小:32 KB 數(shù)據(jù) RAM 大小:128 KB 接口類型:CAN, Ethernet, LIN, SPI,TWI, UART, USB 工作電源電壓:1.8 V to 3.3 V 最大工作溫度:+ 85 C 安裝風格:SMD/SMT 封裝 / 箱體:FBGA-324 |
| MPC7410THX400NE | 制造商:Freescale Semiconductor 功能描述:MPU MPC74XX RISC 64BIT 0.18UM 400MHZ 1.8V/2.5V/3.3V 360FCCBG - Bulk |
| MPC7410THX450NE | 功能描述:微處理器 - MPU NT NITCE RV1.4,1.8V -40C RoHS:否 制造商:Atmel 處理器系列:SAMA5D31 核心:ARM Cortex A5 數(shù)據(jù)總線寬度:32 bit 最大時鐘頻率:536 MHz 程序存儲器大小:32 KB 數(shù)據(jù) RAM 大小:128 KB 接口類型:CAN, Ethernet, LIN, SPI,TWI, UART, USB 工作電源電壓:1.8 V to 3.3 V 最大工作溫度:+ 85 C 安裝風格:SMD/SMT 封裝 / 箱體:FBGA-324 |
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