參數(shù)資料
型號(hào)： MPC740ARX266TX
廠商： FREESCALE SEMICONDUCTOR INC
元件分類： 微控制器/微處理器
英文描述： 32-BIT, 266 MHz, RISC PROCESSOR, CBGA255
封裝： 21 X 21 MM, 3 MM HEIGHT, 1.27 MM PITCH, CERAMIC, BGA-255
文件頁數(shù)： 41/44頁
文件大?。?/td> 558K
代理商： MPC740ARX266TX
6
MPC750A RISC Microprocessor Hardware Specications
General Parameters
— Automatic dynamic power reduction when internal functional units are idle
Integrated Thermal Management Assist Unit
— On-chip thermal sensor and control logic
— Thermal Management Interrupt for software regulation of junction temperature.
Testability
— LSSD scan design
— JTAG interface
Reliability and serviceability—Parity checking on 60x and L2 cache buses
1.3 General Parameters
The following list provides a summary of the general parameters of the MPC750:
Technology:
0.29 m CMOS, ve-layer metal
Die size:
7.56 mm x 8.79 mm (67 mm2)
Transistor count
6.35 million
Logic design
Fully-static
Packages
MPC740: Surface mount 255 ceramic ball grid array (CBGA) without L2
interface
MPC750: Surface mount 360 ceramic ball grid array (CBGA) with L2
interface
Core power supply:
2.6V ± 100 mV
I/O power supply
3.3V ± 5% V dc
1.4 Electrical and Thermal Characteristics
This section provides the AC and DC electrical specications and thermal characteristics for the MPC750.
1.4.1 DC Electrical Characteristics
The tables in this section describe the MPC750 DC electrical characteristics. Table 2 provides the absolute
maximum ratings.
Table 2. Absolute Maximum Ratings
Characteristic
Symbol
MPC750A Value
Unit
Notes
Core supply voltage
Vdd
–0.3 to 2.75
V4
PLL supply voltage
AVdd
–0.3 to 2.75
V
4
L2 DLL supply voltage
L2AVdd
–0.3 to 2.75
V
4
60x bus supply voltage
OVdd
–0.3 to 3.6
V
3,5
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For More Information On This Product,
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