參數(shù)資料
型號(hào)： MPC7400RX333LX
廠商： MOTOROLA INC
元件分類： 微控制器/微處理器
英文描述： 32-BIT, 333 MHz, RISC PROCESSOR, CBGA360
封裝： 25 X 25 MM, 3.20 MM HEIGHT, 1.27 MM PITCH, CERAMIC, BGA-360
文件頁(yè)數(shù)： 36/44頁(yè)
文件大?。?/td> 504K
代理商： MPC7400RX333LX
MPC7400 RISC Microprocessor Hardware Specications
41
PRELIMINARY—SUBJECT TO CHANGE WITHOUT NOTICE
System Design Information
1.8.9.3 Heat Sink Selection Example
The following section provides a heat sink selection example using one of the commercially available heat
sinks.
For preliminary heat sink sizing, the die-junction temperature can be expressed as follows:
Tj = Ta + Tr + (θjc + θint + θsa) * Pd
Where:
Tj is the die-junction temperature
Ta is the inlet cabinet ambient temperature
Tr is the air temperature rise within the computer cabinet
θjc is the junction-to-case thermal resistance
θint is the adhesive or interface material thermal resistance
θsa is the heat sink base-to-ambient thermal resistance
Pd is the power dissipated by the device
During operation the die-junction temperatures (Tj) should be maintained less than the value specied in
Table 3. The temperature of the air cooling the component greatly depends upon the ambient inlet air
temperature and the air temperature rise within the electronic cabinet. An electronic cabinet inlet-air
temperature (Ta) may range from 30 to 40 °C. The air temperature rise within a cabinet (Tr) may be in the
range of 5 to 10 °C. The thermal resistance of the thermal interface material (
θint) is typically about 1 °C/
W. Assuming a Ta of 30 °C, a Tr of 5 °C, a CBGA package θjc = 0.03, and a power consumption (Pd) of 5.0
watts, the following expression for Tj is obtained:
Die-junction temperature: Tj = 30 °C + 5 °C + (0.03 °C/W + 1.0 °C/W + θsa) * 5.0 W
For a Thermalloy heat sink #2328B, the heat sink-to-ambient thermal resistance (
θsa) versus airow
velocity is shown in Figure 26.
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