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參數(shù)資料
| 型號： | MPC5668GF0AVMGR |
| 廠商： | FREESCALE SEMICONDUCTOR INC |
| 元件分類： | 微控制器/微處理器 |
| 英文描述： | 32-BIT, FLASH, 116 MHz, MICROCONTROLLER, PBGA208 |
| 封裝： | 17 X 17 MM, 1 MM PITCH, ROHS COMPLIANT, MO151AAF-1, MAPBGA-208 |
| 文件頁數(shù)： | 21/66頁 |
| 文件大?。?/td> | 889K |
| 代理商： | MPC5668GF0AVMGR |
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MPC5668x Microcontroller Data Sheet, Rev. 3
Preliminary—Subject to Change Without Notice
Electrical Characteristics
Freescale Semiconductor
28
4.2.1
General Notes for Specifications at Maximum Junction Temperature
An estimation of the chip junction temperature, T
J
, can be obtained from the equation:
TJ =TA +(RθJA × PD)
Eqn. 1
where:
TA = ambient temperature for the package (
oC)
RθJA = junction to ambient thermal resistance (
oC/W)
PD = power dissipation in the package (W)
The supplied thermal resistances are provided based on JEDEC JESD51 series of standards to provide consistent values for
estimations and comparisons. The difference between the values determined on the single-layer (1s) board and on the four-layer
board with two signal layers and a power and a ground plane (2s2p) clearly demonstrate that the effective thermal resistance of
the component is not a constant. It depends on the construction of the application board (number of planes), the effective size
of the board which cools the component, how well the component is thermally and electrically connected to the planes, and the
power being dissipated by adjacent components.
Connect all the ground and power balls to the respective planes with one via per ball. Using fewer vias to connect the package
to the planes reduces the thermal performance. Thinner planes also reduce the thermal performance. When the clearance
between through vias leave the planes virtually disconnected, the thermal performance is also greatly reduced.
As a general rule, the value obtained on a single layer board is appropriate for the tightly packed printed circuit board. The value
obtained on the board with the internal planes is usually appropriate if the application board has one oz. (35 micron nominal
thickness) internal planes, the components are well separated, and the overall power dissipation on the board is less than 0.02
W/cm2.
The thermal performance of any component depends strongly on the power dissipation of surrounding components. In addition,
the ambient temperature varies widely within the application. For many natural convection and especially closed box
applications, the board temperature at the perimeter (edge) of the package is approximately the same as the local air temperature
near the device. Specifying the local ambient conditions explicitly as the board temperature provides a more precise description
of the local ambient conditions that determine the temperature of the device.
At a known board temperature, the junction temperature is estimated using the following equation:
TJ =TB +(RθJB × PD)
Eqn. 2
where:
TJ = junction temperature (
oC)
TB = board temperature at the package perimeter (
oC/W)
RθJB = junction to board thermal resistance (
oC/W) per JESD51-8
PD = power dissipation in the package (W)
When the heat loss from the package case to the air can be ignored, acceptable predictions of junction temperature can be made.
The application board should be similar to the thermal test condition, with the component soldered to a board with internal
planes.
Historically, the thermal resistance has frequently been expressed as the sum of a junction to case thermal resistance and a case
to ambient thermal resistance:
RθJA =RθJC +RθCA
Eqn. 3
where:
RθJA = junction to ambient thermal resistance (
oC/W)
Because
of
an
order
from
the
United
States
International
Trade
Commission,
BGA-packaged
product
lines
and
part
numbers
indicated
here
currently
are
not
available
from
Freescale
for
import
or
sale
in
the
United
States
prior
to
September
2010:
MPC5668x
products
in
208
and
256
MAPBGA
packages
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相關代理商/技術(shù)參數(shù) |
參數(shù)描述 |
|---|---|
| MPC5668GF0AVMJ | 制造商:FREESCALE 制造商全稱:Freescale Semiconductor, Inc 功能描述:MPC5668x Microcontroller Data Sheet |
| MPC5668GF0AVMJR | 制造商:FREESCALE 制造商全稱:Freescale Semiconductor, Inc 功能描述:MPC5668x Microcontroller Data Sheet |
| MPC5668GKITJ | 制造商:Freescale Semiconductor 功能描述:EVAL KIT FOR MPC5668 |
| MPC5668GNEXUSADP | 制造商:Freescale Semiconductor 功能描述:NEXUSADP 256TO208MAPBGA - Boxed Product (Development Kits) 制造商:Freescale Semiconductor 功能描述:ADAPTER FOR FULL NEXUS 制造商:Freescale Semiconductor 功能描述:ADAPTER BOARD, MPC5668G/E EVAL KIT, Accessory Type:Adapter Board, For Use With:M 制造商:Freescale Semiconductor 功能描述:ADAPTER BOARD, MPC5668G/E EVAL KIT, Accessory Type:Adapter Board, For Use With:MPC5668G/E Evaluation Kit, Features:256 MAPBGA Emulation Adapter Board for Nexus Access |
| MPC5668X | 制造商:FREESCALE 制造商全稱:Freescale Semiconductor, Inc 功能描述:MPC5668x Microcontroller Data Sheet |
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