Electrical Characteristics
MPC5668x Microcontroller Data Sheet, Rev. 3
Preliminary—Subject to Change Without Notice
Freescale Semiconductor
27
4.2
Thermal Characteristics
1 Functional operating conditions are given in the DC electrical specifications. Absolute maximum ratings are stress ratings only,
and functional operation at the maxima is not guaranteed. Stress beyond the listed maxima may affect device reliability or cause
permanent damage to the device.
2 Absolute maximum specifications for device stress have not yet been determined.
3 2.0 V for 10 hours cumulative time, 1.2 V +10% for time remaining.
4 All functional non-supply I/O pins are clamped to V
SS and VDDEx.
5 V
DDEx are separate power segments and may be powered independently with no differential voltage constraints between the
power segments.
6 AC signal over and undershoot of the input voltages of up to ±2.0 V is permitted for a cumulative duration of 60 hours over the
complete lifetime of the device (injection current does not need to be limited for this duration).
7 Internal structures will hold the input voltage above –1.0 V if the injection current limit of 2 mA is met.
8 Internal structures hold the input voltage below this maximum voltage on all pads powered by V
DDE supplies, if the maximum
injection current specification is met (25 mA for all pins) and VDDE is within Operating Voltage specifications.
9 Total injection current for all pins (including both digital and analog) must not exceed 25 mA.
10 Total injection current for all analog input pins must not exceed 15 mA.
11 Solder profile per CDF-AEC-Q100.
12 Moisture sensitivity per JEDEC test method A112.
Table 5. Thermal Characteristics
Spec
Characteristic
Symbol
Unit
Value
208 MAPBGA
256 MAPBGA
1
Junction to Ambient1, 2
Natural Convection
(Single layer board)
1 Junction temperature is a function of on-chip power dissipation, package thermal resistance, mounting site (board)
temperature, ambient temperature, air flow, power dissipation of other components on the board, and board thermal
resistance.
2 Per SEMI G38-87 and JEDEC JESD51-2 with the single layer board horizontal.
RθJA
°C/W
39
2
Natural Convection
(Four layer board 2s2p)
3 Per JEDEC JESD51-6 with the board horizontal.
RθJA
°C/W
24
3
(@200 ft./min., Single layer board)
RθJMA
°C/W
31
4
(@200 ft./min., Four layer board 2s2p)
RθJMA
°C/W
20
5
Junction to Board4
4 Thermal resistance between the die and the printed circuit board per JEDEC JESD51-8. Board temperature is measured on
the top surface of the board near the package.
RθJB
°C/W
13
6
Junction to Case5
5 Indicates the average thermal resistance between the die and the case top surface as measured by the cold plate method (MIL
SPEC-883 Method 1012.1) with the cold plate temperature used for the case temperature.
RθJC
°C/W
6
7
Junction to Package Top6
Natural Convection
6 Thermal characterization parameter indicating the temperature difference between package top and the junction temperature
per JEDEC JESD51-2.
Ψ
JT
°C/W
2
Because
of
an
order
from
the
United
States
International
Trade
Commission,
BGA-packaged
product
lines
and
part
numbers
indicated
here
currently
are
not
available
from
Freescale
for
import
or
sale
in
the
United
States
prior
to
September
2010:
MPC5668x
products
in
208
and
256
MAPBGA
packages