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參數(shù)資料
| 型號： | MPC5200BV400 |
| 廠商： | MOTOROLA INC |
| 元件分類： | 微控制器/微處理器 |
| 英文描述： | MPC5200 Hardware Specifications |
| 中文描述： | 400 MHz, RISC PROCESSOR, PBGA272 |
| 封裝： | 27 X 27 MM, 1.27 MM PITCH, PLASTIC, BGA-272 |
| 文件頁數(shù)： | 11/76頁 |
| 文件大?。?/td> | 1404K |
| 代理商： | MPC5200BV400 |
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MOTOROLA
MPC5200 Hardware Specifications
11
Electrical and Thermal Characteristics
R
θ
JA
= R
θ
JC
+R
θ
CA
Eqn. 2
where:
R
θ
JA
= junction to ambient thermal resistance (oC/W)
R
θ
JC
= junction to case thermal resistance (oC/W)
R
θ
CA
= case to ambient thermal resistance (oC/W)
R
θ
JC
is device related and cannot be influenced by the user. The user controls the thermal environment to
change the case to ambient thermal resistance, R
θ
CA
. For instance, the user can change the air flow
around the device, add a heat sink, change the mounting arrangement on printed circuit board, or change
the thermal dissipation on the printed circuit board surrounding the device. This description is most useful
for ceramic packages with heat sinks where some 90% of the heat flow is through the case to the heat sink
to ambient. For most packages, a better model is required.
A more accurate thermal model can be constructed from the junction to board thermal resistance and the
junction to case thermal resistance
1-3
. The junction to case covers the situation where a heat sink will be
used or where a substantial amount of heat is dissipated from the top of the package. The junction to
board thermal resistance describes the thermal performance when most of the heat is conducted to the
printed circuit board. This model can be used for either hand estimations or for a computational fluid
dynamics (CFD) thermal model.
To determine the junction temperature of the device in the application after prototypes are available, the
Thermal Characterization Parameter (
Ψ
JT
) can be used to determine the junction temperature with a
measurement of the temperature at the top center of the package case using the following equation:
T
J
= T
T
+(
Ψ
JT
×
P
D
)
Eqn. 3
where:
T
T
= thermocouple temperature on top of package (oC)
Ψ
JT
= thermal characterization parameter (oC/W)
P
D
= power dissipation in package (W)
The thermal characterization parameter is measured per JESD51-2 specification using a 40-gauge type T
thermocouple epoxied to the top center of the package case. The thermocouple should be positioned, so
that the thermocouple junction rests on the package. A small amount of epoxy is placed over the
thermocouple junction and over approximately one mm of wire extending from the junction. The
thermocouple wire is placed flat against the package case to avoid measurement errors caused by cooling
effects of the thermocouple wire.
F
Freescale Semiconductor, Inc.
For More Information On This Product,
Go to: www.freescale.com
n
.
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| MPC5200CBV266 | 功能描述:微處理器 - MPU 266MHz 760MIPS RoHS:否 制造商:Atmel 處理器系列:SAMA5D31 核心:ARM Cortex A5 數(shù)據(jù)總線寬度:32 bit 最大時鐘頻率:536 MHz 程序存儲器大小:32 KB 數(shù)據(jù) RAM 大小:128 KB 接口類型:CAN, Ethernet, LIN, SPI,TWI, UART, USB 工作電源電壓:1.8 V to 3.3 V 最大工作溫度:+ 85 C 安裝風格:SMD/SMT 封裝 / 箱體:FBGA-324 |
| MPC5200CBV400 | 功能描述:微處理器 - MPU 400MHz 760MIPS RoHS:否 制造商:Atmel 處理器系列:SAMA5D31 核心:ARM Cortex A5 數(shù)據(jù)總線寬度:32 bit 最大時鐘頻率:536 MHz 程序存儲器大小:32 KB 數(shù)據(jù) RAM 大小:128 KB 接口類型:CAN, Ethernet, LIN, SPI,TWI, UART, USB 工作電源電壓:1.8 V to 3.3 V 最大工作溫度:+ 85 C 安裝風格:SMD/SMT 封裝 / 箱體:FBGA-324 |
| MPC5200CBV400B | 制造商:Freescale Semiconductor 功能描述: |
| MPC5200CVR266 | 功能描述:微處理器 - MPU NO-PB IND’L 5200 266MHZ RoHS:否 制造商:Atmel 處理器系列:SAMA5D31 核心:ARM Cortex A5 數(shù)據(jù)總線寬度:32 bit 最大時鐘頻率:536 MHz 程序存儲器大小:32 KB 數(shù)據(jù) RAM 大小:128 KB 接口類型:CAN, Ethernet, LIN, SPI,TWI, UART, USB 工作電源電壓:1.8 V to 3.3 V 最大工作溫度:+ 85 C 安裝風格:SMD/SMT 封裝 / 箱體:FBGA-324 |
| MPC5200CVR400 | 功能描述:微處理器 - MPU NO-PB IND’L 5200 400MHZ RoHS:否 制造商:Atmel 處理器系列:SAMA5D31 核心:ARM Cortex A5 數(shù)據(jù)總線寬度:32 bit 最大時鐘頻率:536 MHz 程序存儲器大小:32 KB 數(shù)據(jù) RAM 大小:128 KB 接口類型:CAN, Ethernet, LIN, SPI,TWI, UART, USB 工作電源電壓:1.8 V to 3.3 V 最大工作溫度:+ 85 C 安裝風格:SMD/SMT 封裝 / 箱體:FBGA-324 |
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