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| 型號： | MPC5200BV400 |
| 廠商： | MOTOROLA INC |
| 元件分類： | 微控制器/微處理器 |
| 英文描述： | MPC5200 Hardware Specifications |
| 中文描述： | 400 MHz, RISC PROCESSOR, PBGA272 |
| 封裝： | 27 X 27 MM, 1.27 MM PITCH, PLASTIC, BGA-272 |
| 文件頁數(shù)： | 10/76頁 |
| 文件大小： | 1404K |
| 代理商： | MPC5200BV400 |
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10
MPC5200 Hardware Specifications
MOTOROLA
Electrical and Thermal Characteristics
3.1.6 Thermal Characteristics
3.1.6.1
An estimation of the chip-junction temperature, T
J
, can be obtained from the following equation:
T
J
= T
A
+(R
θ
JA
×
P
D
)
Heat Dissipation
Eqn. 1
where:
T
A
= ambient temperature for the package (oC)
R
θ
JA
= junction to ambient thermal resistance (oC/W)
P
D
= power dissipation in package (W)
The junction to ambient thermal resistance is an industry standard value, which provides a quick and easy
estimation of thermal performance. Unfortunately, there are two values in common usage: the value
determined on a single layer board, and the value obtained on a board with two planes. For packages such
as the PBGA, these values can be different by a factor of two. Which value is correct depends on the power
dissipated by other components on the board. The value obtained on a single layer board is appropriate for
the tightly packed printed circuit board. The value obtained on the board with the internal planes is usually
appropriate if the board has low power dissipation and the components are well separated.
Historically, the thermal resistance has frequently been expressed as the sum of a junction to case thermal
resistance and a case to ambient thermal resistance:
Table 7 Thermal Resistance Data
Rating
Value
Unit
Notes
SpecID
Junction to Ambient
Natural Convection
Single layer board
(1s)
R
θ
JA
30
°C/W
1
,
2
1
Junction temperature is a function of die size, on-chip power dissipation, package thermal resistance, mounting site
(board) temperature, ambient temperature, air flow, power dissipation of other components on the board, and board
thermal resistance.
Per SEMI G38-87 and JEDEC JESD51-2 with the single layer board horizontal.
Per JEDEC JESD51-6 with the board horizontal.
Thermal resistance between the die and the printed circuit board per JEDEC JESD51-8. Board temperature is mea-
sured on the top surface of the board near the package.
Thermal resistance between the die and the case top surface as measured by the cold plate method (MIL SPEC-883
Method 1012.1).
Thermal characterization parameter indicating the temperature difference between package top and the junction
temperature per JEDEC JESD51-2. When Greek letters are not available, the thermal characterization parameter is
written as Psi-JT.
2
3
4
D6.1
Junction to Ambient
Natural Convection
Four layer board (2s2p)
R
θ
JMA
22
°C/W
1
,
3
D6.2
Junction to Ambient
(@200 ft/min)
Single layer board
(1s)
R
θ
JMA
24
°C/W
1
,
3
D6.3
Junction to Ambient
(@200 ft/min)
Four layer board
(2s2p)
R
θ
JMA
19
°C/W
1
,
3
D6.4
Junction to Board
R
θ
JB
R
θ
JC
Ψ
JT
14
°C/W
4
D6.5
Junction to Case
8
°C/W
5
5
D6.6
Junction to Package Top Natural Convection
2
°C/W
6
6
D6.7
F
Freescale Semiconductor, Inc.
For More Information On This Product,
Go to: www.freescale.com
n
.
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